Fingerprint The fingerprint is based on mining the text of the scientific documents related to the associated persons. Based on that an index of weighted terms is created, which defines the key subjects of research unit

Data storage equipment Engineering & Materials Science
Wavelength Engineering & Materials Science
wavelengths Physics & Astronomy
quantum cascade lasers Physics & Astronomy
Photons Engineering & Materials Science
Image reconstruction Engineering & Materials Science
photometers Physics & Astronomy
metalorganic chemical vapor deposition Physics & Astronomy

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Research Output 1961 2020

MAP Interpolation of an Ising Image Block

Reyes, M. G., Neuhoff, D. L. & Pappas, T. N., Jan 1 2020, Advances in Computer Vision - Proceedings of the 2019 Computer Vision Conference CVC. Kapoor, S. & Arai, K. (eds.). Springer Verlag, p. 237-256 20 p. (Advances in Intelligent Systems and Computing; vol. 943).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ising model
Interpolation

19.4 An Adaptive Clock Management Scheme Exploiting Instruction-Based Dynamic Timing Slack for a General-Purpose Graphics Processor Unit with Deep Pipeline and Out-of-Order Execution

Jia, T., Joseph, R. & Gu, J., Mar 6 2019, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., p. 318-320 3 p. 8662389. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2019-February).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Clocks
Pipelines
Error detection
Program processors
Networks (circuits)

19.7 A Scalable Pipelined Time-Domain DTW Engine for Time-Series Classification Using Multibit Time Flip-Flops with 140Giga-Cell-Updates/s Throughput

Chen, Z. & Gu, J., Mar 6 2019, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., p. 324-326 3 p. 8662340. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2019-February).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Flip flop circuits
Time series
Throughput
Engines
DNA

Grants 1996 2024

Electric fields
Data storage equipment
Induced currents
Electric potential
Magnetization
Processing
Sensor nodes
Learning systems
Automation
Sensors