Research Output per year
Fingerprint The fingerprint is based on mining the text of the scientific documents related to the associated persons. Based on that an index of weighted terms is created, which defines the key subjects of research unit
Polymers
Chemical Compounds
Temperature
Engineering & Materials Science
Metals
Chemical Compounds
Cracks
Engineering & Materials Science
Composite materials
Engineering & Materials Science
Concretes
Engineering & Materials Science
Thin films
Engineering & Materials Science
Oxides
Chemical Compounds
Network
Recent external collaboration on country level. Dive into details by clicking on the dots.
Profiles
Daniel M Abrams
- Engineering Sciences and Applied Mathematics - Associate Professor
- Engineering Sciences and Applied Mathematics PhD Program - Core
Person: Academic
Jan Drewes Achenbach
- Civil and Environmental Engineering - Professor Emeritus
- Mechanical Engineering - Professor Emeritus
Person: Academic
Ankit Agrawal
- Electrical Engineering and Computer Science - Research Associate Professor
Person: Academic
Research Output 1957 2019
19.4 An Adaptive Clock Management Scheme Exploiting Instruction-Based Dynamic Timing Slack for a General-Purpose Graphics Processor Unit with Deep Pipeline and Out-of-Order Execution
Jia, T., Joseph, R. & Gu, J., Mar 6 2019, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., p. 318-320 3 p. 8662389. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2019-February).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Clocks
Pipelines
Error detection
Program processors
Networks (circuits)
19.7 A Scalable Pipelined Time-Domain DTW Engine for Time-Series Classification Using Multibit Time Flip-Flops with 140Giga-Cell-Updates/s Throughput
Chen, Z. & Gu, J., Mar 6 2019, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., p. 324-326 3 p. 8662340. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2019-February).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Flip flop circuits
Time series
Throughput
Engines
DNA
3D ink-extrusion additive manufacturing of CoCrFeNi high-entropy alloy micro-lattices
Kenel, C., Casati, N. P. M. & Dunand, D. C., Dec 1 2019, In : Nature communications. 10, 1, 904.Research output: Contribution to journal › Article
Open Access
3D printers
Ink
Entropy
inks
Extrusion
Grants 1992 2023
REU SITE: RESEARCH EXPERIENCE FOR UNDERGRADUATES IN NANOSCALE SCIENCE AND ENGINEERING PROPOSAL
Balogun, O., Dravid, V. P., Freedman, D. E., Hersam, M., Keten, S., Mirkin, C. A., Nguyen, S., Odom, T. W., Stupp, S. & Weiss, E. A.
2/1/19 → 1/31/22
Project: Research project
engineering
science
nanotechnology
experience
EEC
American Australian Association-Dow Chemical Company Scholarship
American Australian Association Inc.
1/1/19 → 12/31/19
Project: Research project
Fellowship
A Biophysical Approach to Uncover the Role of Cell Membrane Mechanics in Sensing Mechanical Force
Air Force Office of Scientific Research
1/1/19 → 12/31/21
Project: Research project
Mechanics
Cell Membrane
Ion Channels
Membranes
Elasticity