Andrew Wayne Ott

  • 2527 Citations
19942018

Research output per year

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Research Output

  • 2527 Citations
  • 18 Article
  • 3 Conference article
  • 2 Conference contribution
  • 1 Comment/debate
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Conference article
2004

A 65nm logic technology featuring 35nm gate lengths, enhanced channel strain, 8 Cu interconnect layers, low-k ILD and 0.57 μm2 SRAM cell

Bai, P., Auth, C., Balakrishnan, S., Bost, M., Brain, R., Chikarmane, V., Heussner, R., Hussein, M., Hwang, J., Ingerly, D., James, R., Jeong, J., Kenyon, C., Lee, E., Lee, S. H., Lindert, N., Liu, M., Ma, Z., Marieb, T., Murthy, A. & 15 others, Nagisetty, R., Natarajan, S., Neirynck, J., Ott, A., Parker, C., Sebastian, J., Shaheed, R., Sivakumar, S., Steigerwald, J., Tyagi, S., Weber, C., Woolery, B., Yeoh, A., Zhang, K. & Bohr, M., Dec 1 2004, In : Technical Digest - International Electron Devices Meeting, IEDM. p. 657-660 4 p.

Research output: Contribution to journalConference article

194 Scopus citations

Impact of interfacial chemistry on adhesion and electromigration in Cu interconnects

Zhou, Y., Scherban, T., Xu, G., He, J., Miner, B., Jan, C. H., Ott, A., O'Loughlin, J., Ingerly, D. & Leu, J., Dec 1 2004, In : Advanced Metallization Conference (AMC). p. 189-199 11 p.

Research output: Contribution to journalConference article

4 Scopus citations
2001

A Cu interconnect process for the 130 nm process technology node

Moon, P., Allen, C., Anand, N., Austin, D., Bramblett, T., Fradkin, M., Fu, S., Hussein, M., Jeong, J., Lo, C., Ott, A., Smith, P. & Rumaner, L., Dec 1 2001, In : Advanced Metallization Conference (AMC). p. 39-41 3 p.

Research output: Contribution to journalConference article

3 Scopus citations