Grants per year
Personal profile
Education/Academic qualification
Electrical Engineering, PhD, University of California, Los Angeles
… → 2003
Electrical and Computer Engineering, MS, Northwestern University
… → 2000
Computer Engineering, BS, Bogazici University
… → 1998
Fingerprint Dive into the research topics where Gokhan Memik is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 12 Similar Profiles
Electric power utilization
Engineering & Materials Science
Data storage equipment
Engineering & Materials Science
Field programmable gate arrays (FPGA)
Engineering & Materials Science
Energy utilization
Engineering & Materials Science
Program processors
Engineering & Materials Science
Nanophotonics
Engineering & Materials Science
Data mining
Engineering & Materials Science
Temperature control
Engineering & Materials Science
Network
Recent external collaboration on country level. Dive into details by clicking on the dots.
Grants 2004 2017
- 13 Finished
Cooling
Hot Temperature
Data storage equipment
Costs
Dynamical systems
SHF: Small: Thermal-Aware High-Performance DRAM Architectures in Multicore Technologies
9/1/09 → 8/31/14
Project: Research project
CAREER: Holistic Computer Architectures for Nanoscale Processors
4/1/08 → 9/30/14
Project: Research project
Support for the 40th Annual ACM/IEEE International Symposium of Microarchitecture, 2007
12/1/07 → 11/30/08
Project: Research project
Research Output 2000 2019
1
Citation
(Scopus)
Minimizing Thermal Variation in Heterogeneous HPC Systems with FPGA Nodes
Luo, Y., Wang, X., Memik, S. O., Memik, G., Yoshii, K. & Beckman, P., Jan 16 2019, Proceedings - 2018 IEEE 36th International Conference on Computer Design, ICCD 2018. Institute of Electrical and Electronics Engineers Inc., p. 537-544 8 p. 8615736. (Proceedings - 2018 IEEE 36th International Conference on Computer Design, ICCD 2018).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Field programmable gate arrays (FPGA)
Particle accelerators
Learning systems
Hot Temperature
Cooling
1
Citation
(Scopus)
Writeback-aware LLC management for PCM-based main memory systems
Pourshirazi, B., Valad Beigi, M., Zhu, Z. & Memik, G., Jan 2019, In : ACM Transactions on Design Automation of Electronic Systems. 24, 2, a18.Research output: Contribution to journal › Article
Phase change memory
Data storage equipment
Dynamic random access storage
Energy utilization
Energy efficiency
10
Citations
(Scopus)
Machine Learning-Based Temperature Prediction for Runtime Thermal Management Across System Components
Zhang, K., Guliani, A., Memik, S. O., Memik, G., Yoshii, K., Sankaran, R. & Beckman, P., Feb 1 2018, In : IEEE Transactions on Parallel and Distributed Systems. 29, 2, p. 405-419 15 p., 7995115.Research output: Contribution to journal › Article
Temperature control
Learning systems
Temperature
Linear regression
Neural networks
7
Citations
(Scopus)
Thermal-aware optimizations of ReRAM-based neuromorphic computing systems
Beigi, M. V. & Memik, G., Jun 24 2018, Proceedings of the 55th Annual Design Automation Conference, DAC 2018. Institute of Electrical and Electronics Engineers Inc., a39. (Proceedings - Design Automation Conference; vol. Part F137710).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Optimization
Computing
Neural Networks
Neural networks
Temperature
3
Citations
(Scopus)
Thor: Thermal-aware optimizations for extending reram lifetime
Valad Beigi, M. & Memik, G., Aug 3 2018, Proceedings - 2018 IEEE 32nd International Parallel and Distributed Processing Symposium, IPDPS 2018. Institute of Electrical and Electronics Engineers Inc., p. 670-679 10 p. 8425220. (Proceedings - 2018 IEEE 32nd International Parallel and Distributed Processing Symposium, IPDPS 2018).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Data storage equipment
Durability
Hot Temperature
RRAM
Dynamic random access storage