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Seda Ogrenci Memik

  • 1380 Citations
20002020

Research output per year

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Personal profile

Education/Academic qualification

Computer Science, PhD, University of California at Los Angeles

… → 2003

Electrical and Computer Engineering, MS, Northwestern University

… → 2000

Electrical and Electronic Engineering, BS, Bogazici University

… → 1998

Research interests

  • Design Automation
  • Thermal aware design of circuits and systems
  • Thermal sensing and cooling systems for high performance systems
  • Power and energy aware memory systems

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Grants

Testing and Characterization for Pattern Recognition ASIC Development

Memik, S. O.

Fermi Research Alliance, LLC, Fermi National Accelerator Laboratory, Department of Energy

11/21/17 → 12/31/19

Project: Research project

    • COOLR: A New System for Dynamic Thermal-Aware Computing

    Memik, G. & Memik, S. O.

    Department of Energy

    9/1/14 → 8/31/17

    Project: Research project

    • REU Supplement for SHF: Small:Thermal Monitoring in 3D Integrated Circuits with Bimetallic Thin Film Thermocouples

    Grayson, M. A., Memik, S. O. & Memik, S. O.

    National Science Foundation

    7/15/14 → 6/30/18

    Project: Research project

    • SHF: Small:Thermal Monitoring in 3D Integrated Circuits with Bimetallic Thin Film Thermocouples

    Grayson, M. A. & Memik, S. O.

    National Science Foundation

    7/15/14 → 6/30/18

    Project: Research project

    • Power and Thermal Analysis of Custom Chips for Real Time Data Processing in High Energy Physics (HEP) Experiments

    Memik, S. O.

    Universities Research Association, Inc.

    7/1/14 → 6/30/15

    Project: Research project

    • Research Output

    A Low-Power, High-Speed Readout for Pixel Detectors Based on an Arbitration Tree

    Fahim, F., Joshi, S., Ogrenci-Memik, S. & Mohseni, H., Feb 2020, In : IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 28, 2, p. 576-584 9 p., 8930978.

    Research output: Contribution to journal › Article

    • 1 Scopus citations

    Micro-Scale 2D Thermal Gradiometer

    Yan, X., Ogrenci-Memik, S. & Grayson, M. A., May 2020, In : IEEE Electron Device Letters. 41, 5, p. 761-764 4 p., 9037306.

    Research output: Contribution to journal › Article

    • A combined arithmetic-high-level synthesis solution to deploy partial carry-save radix-8 booth multipliers in datapaths

    Del Barrio, A. A., Hermida, R. & Memik, S. O., Feb 2019, In : IEEE Transactions on Circuits and Systems I: Regular Papers. 66, 2, p. 742-755 14 p., 8451942.

    Research output: Contribution to journal › Article

    • 3 Scopus citations

    Minimizing Thermal Variation in Heterogeneous HPC Systems with FPGA Nodes

    Luo, Y., Wang, X., Memik, S. O., Memik, G., Yoshii, K. & Beckman, P., Jan 16 2019, Proceedings - 2018 IEEE 36th International Conference on Computer Design, ICCD 2018. Institute of Electrical and Electronics Engineers Inc., p. 537-544 8 p. 8615736. (Proceedings - 2018 IEEE 36th International Conference on Computer Design, ICCD 2018).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    • 1 Scopus citations

    Machine Learning-Based Temperature Prediction for Runtime Thermal Management Across System Components

    Zhang, K., Guliani, A., Memik, S. O., Memik, G., Yoshii, K., Sankaran, R. & Beckman, P., Feb 1 2018, In : IEEE Transactions on Parallel and Distributed Systems. 29, 2, p. 405-419 15 p., 7995115.

    Research output: Contribution to journal › Article

    • 14 Scopus citations