Grants per year
Personal profile
Education/Academic qualification
Computer Science, PhD, University of California at Los Angeles
… → 2003
Electrical and Computer Engineering, MS, Northwestern University
… → 2000
Electrical and Electronic Engineering, BS, Bogazici University
… → 1998
Research interests
- Design Automation
- Thermal aware design of circuits and systems
- Thermal sensing and cooling systems for high performance systems
- Power and energy aware memory systems
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Dive into the research topics where Seda Ogrenci Memik is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Recent external collaboration on country level. Dive into details by clicking on the dots.
Grants
- 12 Finished
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Testing and Characterization for Pattern Recognition ASIC Development
Fermi Research Alliance, LLC, Fermi National Accelerator Laboratory, Department of Energy
11/21/17 → 12/31/19
Project: Research project
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REU Supplement for SHF: Small:Thermal Monitoring in 3D Integrated Circuits with Bimetallic Thin Film Thermocouples
Grayson, M. A., Memik, S. O. & Memik, S. O.
7/15/14 → 6/30/18
Project: Research project
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SHF: Small:Thermal Monitoring in 3D Integrated Circuits with Bimetallic Thin Film Thermocouples
7/15/14 → 6/30/18
Project: Research project
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Power and Thermal Analysis of Custom Chips for Real Time Data Processing in High Energy Physics (HEP) Experiments
Universities Research Association, Inc.
7/1/14 → 6/30/15
Project: Research project
Research Output
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A Low-Power, High-Speed Readout for Pixel Detectors Based on an Arbitration Tree
Fahim, F., Joshi, S., Ogrenci-Memik, S. & Mohseni, H., Feb 2020, In: IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 28, 2, p. 576-584 9 p., 8930978.Research output: Contribution to journal › Article › peer-review
1 Scopus citations -
Micro-Scale 2D Thermal Gradiometer
Yan, X., Ogrenci-Memik, S. & Grayson, M. A., May 2020, In: IEEE Electron Device Letters. 41, 5, p. 761-764 4 p., 9037306.Research output: Contribution to journal › Article › peer-review
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A combined arithmetic-high-level synthesis solution to deploy partial carry-save radix-8 booth multipliers in datapaths
Del Barrio, A. A., Hermida, R. & Memik, S. O., Feb 2019, In: IEEE Transactions on Circuits and Systems I: Regular Papers. 66, 2, p. 742-755 14 p., 8451942.Research output: Contribution to journal › Article › peer-review
7 Scopus citations -
Minimizing Thermal Variation in Heterogeneous HPC Systems with FPGA Nodes
Luo, Y., Wang, X., Memik, S. O., Memik, G., Yoshii, K. & Beckman, P., Jan 16 2019, Proceedings - 2018 IEEE 36th International Conference on Computer Design, ICCD 2018. Institute of Electrical and Electronics Engineers Inc., p. 537-544 8 p. 8615736. (Proceedings - 2018 IEEE 36th International Conference on Computer Design, ICCD 2018).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
3 Scopus citations -
Machine Learning-Based Temperature Prediction for Runtime Thermal Management Across System Components
Zhang, K., Guliani, A., Memik, S. O., Memik, G., Yoshii, K., Sankaran, R. & Beckman, P., Feb 1 2018, In: IEEE Transactions on Parallel and Distributed Systems. 29, 2, p. 405-419 15 p., 7995115.Research output: Contribution to journal › Article › peer-review
24 Scopus citations