Grants per year
Personal profile
Research Interests
Professor Huang is interested in mechanics of stretchable and flexible electronics, and deterministic 3D assembly.
Education/Academic qualification
Engineering Science, PhD, Harvard University
… → 1990
Engineering Science, MS, Harvard University
… → 1987
Mechanics, BS, Peking University
… → 1984
Research interests keywords
- Atomistic-based continuum mechanics
- Composite materials
- Fracture mechanics
- Mechanics of materials and structures
- Mechanics of stretchable electronics
- Micromechanics
Fingerprint
Dive into the research topics where Yonggang Huang is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
Grants
- 23 Finished
-
Yonggang Huang for SP0053685
NorthShore University HealthSystem Research Institute, National Institute of Neurological Disorders and Stroke
2/15/20 → 8/15/20
Project: Research project
-
SNM: Collaborative Research: 3D Nanomaunfacturing by Imprint and Strain Engineering (3D NISE)
Johns Hopkins University, National Science Foundation
9/1/16 → 8/31/20
Project: Research project
-
-
Subproject for Institution # SP0030422
National Institute of Biomedical Imaging and Bioengineering
9/22/14 → 5/31/19
Project: Research project
-
A battery-less wireless implant for the continuous monitoring of vascular pressure, flow rate and temperature
Kwon, K., Kim, J. U., Won, S. M., Zhao, J., Avila, R., Wang, H., Chun, K. S., Jang, H., Lee, K. H., Kim, J. H., Yoo, S., Kang, Y. J., Kim, J., Lim, J., Park, Y., Lu, W., Kim, T. I., Banks, A., Huang, Y. & Rogers, J. A., Oct 2023, In: Nature Biomedical Engineering. 7, 10, p. 1215-1228 14 p.Research output: Contribution to journal › Article › peer-review
7 Scopus citations -
An analytical model for sensing microvascular blood flow in flaps and organ grafts
Li, S., Lu, D., Pet, M., Rogers, J. A. & Huang, Y., Jan 2023, In: Journal of the Mechanics and Physics of Solids. 170, 105119.Research output: Contribution to journal › Article › peer-review
-
A Sewing Approach to the Fabrication of Eco/bioresorbable Electronics
Wu, Y., Rytkin, E., Bimrose, M., Li, S., Choi, Y. S., Lee, G., Wang, Y., Tang, L., Madrid, M., Wickerson, G., Chang, J. K., Gu, J., Zhang, Y., Liu, J., Tawfick, S., Huang, Y., King, W. P., Efimov, I. R. & Rogers, J. A., 2023, (Accepted/In press) In: Small.Research output: Contribution to journal › Article › peer-review
Open Access -
A wireless and battery-less implant for multimodal closed-loop neuromodulation in small animals
Ouyang, W., Lu, W., Zhang, Y., Liu, Y., Kim, J. U., Shen, H., Wu, Y., Luan, H., Kilner, K., Lee, S. P., Lu, Y., Yang, Y., Wang, J., Yu, Y., Wegener, A. J., Moreno, J. A., Xie, Z., Wu, Y., Won, S. M., Kwon, K., & 21 others, Oct 2023, In: Nature Biomedical Engineering. 7, 10, p. 1252-1269 18 p.Research output: Contribution to journal › Article › peer-review
3 Scopus citations -
Bioresorbable, wireless, and battery-free system for electrotherapy and impedance sensing at wound sites
Song, J. W., Ryu, H., Bai, W., Xie, Z., Vázquez-Guardado, A., Nandoliya, K., Avila, R., Lee, G., Song, Z., Kim, J., Lee, M. K., Liu, Y., Kim, M., Wang, H., Wu, Y., Yoon, H. J., Kwak, S. S., Shin, J., Kwon, K., Lu, W., & 4 others, Feb 2023, In: Science Advances. 9, 8, eade4687.Research output: Contribution to journal › Article › peer-review
Open Access13 Scopus citations
Datasets
-
Supplementary material from "Postbuckling analyses of frame mesostructures consisting of straight ribbons for mechanically guided three-dimensional assembly"
Liu, Y. (Creator), Xu, Z. (Creator), Hwang, K. (Contributor), Huang, Y. (Contributor), Zhang, Y. (Contributor) & Yonggang, H. (Contributor), figshare, 2019
DOI: 10.6084/m9.figshare.c.4510211, https://rs.figshare.com/collections/Supplementary_material_from_Postbuckling_analyses_of_frame_mesostructures_consisting_of_straight_ribbons_for_mechanically_guided_three-dimensional_assembly_/4510211
Dataset