CRII: RI: Sub-mm 3D Scanning of Real-World Scenes with Active Multi-View Event Sensing

This proposal introduces a “one fits all” solution concept for quantitative, fast, and precise 3D sensing of arbitrary scenes with mixed reflectance properties. The solution is based on well-known high-resolution 3D metrology principles but facilitates sophisticated evaluation algorithms and novel event-based sensor technology to measure complicated “real-world” scenes.