A highly flexible, multi-material capable micro-machining process is proposed based on ultra-short pulsed plasma creation within a liquid dielectric that is manipulated and enhanced by applying an external magnetic field of controlled distribution. This subtractive material removal process will achieve much higher processing rates than conventional laser ablation and the original laser-induced plasma micro-machining process, as well as incorporate the in-process capability to generate different shapes and patterns on the workpiece surface at a fast rate without workpiece translation.
|Effective start/end date||6/1/16 → 5/31/21|
- National Science Foundation (CMMI-1563244)
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