Keyphrases
Bimetallic Thin Film
100%
Thermal Monitoring
100%
3D IC
100%
Integrated Circuits
100%
Thin-film Thermocouple
100%
Thermocouple
100%
Thermal Map
66%
Process Variation
50%
High Performance
33%
Thermal Sensor
33%
Thermal Mapping
33%
Temperature Sensing
33%
Bimetallic
33%
Highly Accurate
33%
Seebeck Coefficient
33%
Technological Progress
16%
Power Density
16%
Yield Limit
16%
Preliminary Samples
16%
Resistive Heater
16%
High Spatial Resolution
16%
Interface Quality
16%
High Density
16%
Layer Thickness
16%
Chip Performance
16%
Custom Design
16%
Effective Power
16%
Independent Optimization
16%
Energy Efficient
16%
Sustainable Computing
16%
Circuit Performance
16%
Emerging Processes
16%
Effective Integration
16%
Semiconductor Industry
16%
Constantan
16%
Proposed Design
16%
Quality Techniques
16%
Optimization Techniques
16%
Circuit Integration
16%
Existing Technology
16%
Dynamic Power Optimization
16%
Interface Processing
16%
Heater Element
16%
Dynamic Resource Allocation
16%
Semiconductor Substrate
16%
Thermal Load
16%
Diagnostic Tool
16%
Bimetallic Sensor
16%
NiCrBSi
16%
Passive Technology
16%
Dynamic Performance Optimization
16%
Performance Region
16%
Increased Yield
16%
Thermal Challenge
16%
Diode
16%
Power Efficiency
16%
Film Thickness
16%
Local Temperature
16%
On-chip Integration
16%
Sensor Layer
16%
Thermal Management
16%
Undergraduate Students
16%
Additional Power
16%
Undergraduate Researchers
16%
Patent Application
16%
Energy Efficiency
16%
Real Estate
16%
Critical Performance
16%
Process Technology
16%
Processing Techniques
16%
Design Optimization
16%
Material Parameters
16%
Silicon Layer
16%
Thermal Signal
16%
Bimetallic Interface
16%
Thermal Impact
16%
Integration Efficiency
16%
Thermal Measurement
16%
Process Invariant
16%
Performance Efficiency
16%
Input Power
16%
Engineering
Three Dimensional Integrated Circuits
100%
Thermocouple
100%
Thin Films
100%
Integrated Circuit
75%
Process Variation
37%
Theoretical Work
25%
Thermal Sensor
25%
Seebeck Effect
25%
Circuit Performance
12%
Processing Technique
12%
Input Power
12%
Layer Thickness
12%
Experimental Work
12%
Material Parameter
12%
Power Density
12%
Emerging Process
12%
Silicon Layer
12%
Future Technology
12%
Resistive
12%
Energy Efficiency
12%
Design Optimization
12%
Optimization Technique
12%
Patent Application
12%
Spatial Resolution
12%
Integrated System
12%
Heater Element
12%
Thermal Impact
12%
Hot Spot
12%
Technological Development
12%
Thermal Load
12%