SNM: Collaborative Research: 3D Nanomaunfacturing by Imprint and Strain Engineering (3D NISE)

Scope of work The co-PIs at Northwestern University, Yonggang Huang and John A. Rogers, will be lead or participate in the following aspects of the project. 1) Develop methods to pattern and transfer functional materials such as device grade silicon; 2) Design, model and characterize strain mechanisms in these materials and underlying substrates so that large numbers of 3D nanostructures can be self-folded or popped-up; 3) Test and optimize functionality of the mass-produced 3D-nanostructures; and 4) Optimize manufacturing protocols using statistical design of experiments and defect-yield analysis.