Project Details
| Status | Finished |
|---|---|
| Effective start/end date | 9/1/09 → 2/28/11 |
Funding
- University of Michigan (2009-HJ-2024 // 2003-TJ-1073)
- Semiconductor Research Corporation (2009-HJ-2024 // 2003-TJ-1073)
Thermal-Aware Unified Architectural and Physical Design of Reliable Integrated Systems
- Zhou, Hai (PD/PI)
Project: Research project