Keyphrases
Ultra-low Energy
100%
Receiver-driven
100%
Optical Interconnects
100%
Energy Receiver
100%
Integration Platform
100%
Electron-injection Detector
100%
Photonic Integration
100%
Integration Method
25%
III-V Optoelectronics
25%
Increased Density
25%
All-silicon
25%
Driving Voltage
25%
System Functionality
25%
Capacitance
25%
Electrical Interconnect
25%
Integrated Receiver
25%
Novel Receiver
25%
Detector Sensitivity
25%
Die-to-wafer Bonding
25%
Material Requirements
25%
Integrated Element
25%
Material Functionality
25%
Requirement Set
25%
Die-to-die
25%
Power Consumption
25%
Electronic Circuit
25%
Integrated Optical
25%
Low Power Consumption
25%
Silicon CMOS
25%
System Requirements
25%
Bonding Process
25%
Electrical Interconnection
25%
Intrinsic Limits
25%
Energy Efficiency
25%
Photonics
25%
Optical Element
25%
Chip-scale
25%
III-V
25%
Material System
25%
Engineering
Electron Injection
100%
Integration Platform
100%
Photonic Integration
100%
Optical Interconnect
100%
Material System
25%
Wafer Bonding
25%
System Requirement
25%
Electric Power Utilization
25%
Limitations
25%
System Functionality
25%
Optical Element
25%
Integration Method
25%
Networks (Circuits)
25%
Electrical Interconnects
25%
Voltage Driving
25%
Optoelectronics
25%
Photonics
25%
Energy Efficiency
25%