3D-STAF: Scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits

Keyphrases

• Three-dimensional (3D) 100%
• 3D IC 100%
• Floorplanning 100%
• Force-directed 33%
• Wirelength 22%
• Physical Data 11%
• Temperature Effect 11%
• Optimization Approach 11%
• Peak Temperature 11%
• Temperature Gradient 11%
• Temperature Sensing 11%
• Stochastic Optimization Methods 11%
• Feedback Loop 11%
• Large-scale Problems 11%
• Problem Instances 11%
• Area-length 11%
• Leakage Power 11%
• Leakage Model 11%
• Thermal Profile 11%
• Optimization Flow 11%
• Heterogeneous Blocks 11%
• Thermal Leakage 11%
• White Space 11%
• Integrated Circuit Design 11%
• Thermal Issues 11%

Engineering

• Three Dimensional Integrated Circuits 100%
• Electric Power Utilization 50%
• Combined Flow 50%
• Good Performance 50%
• Integrated Circuit Design 50%
• Peak Temperature 50%
• Optimization Technique 50%
• Feedback Loop 50%
• Thermal Gradient 50%
• Temperature Gradients 50%

Computer Science

• Floorplanning 100%
• Integrated Circuit 100%
• Feedback Loop 20%
• Power Consumption 20%
• Problem Instance 20%
• Optimization Technique 20%
• Stochastic Optimization 20%
• Thermal Profile 20%
• Physical Information 20%
• White Space 20%
• Integrated Circuit Design 20%
• Good Performance 20%
• Peak Temperature 20%
• Temperature Gradients 20%
• Thermal Gradient 20%