A comparison of metal adhesion layers for Au films in thermo-plasmonic applications

William M. Abbott, Christopher P. Murray, Sorcha Ní Lochlainn, Frank Bello, Chuan Zhong, Christopher Smith, Amanda K. Petford-Long, John F. Donegan*, David McCloskey

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The dewetting resistance of Au 50 nm films fabricated atop Ti/Ta/W/Cr/Al adhesion layers (0.5-5 nm) was investigated. Results show sub-nanometer Ta has superior stability under thermal stress, while W & Ti show best plasmonic response.

Original languageEnglish (US)
Title of host publicationCLEO
Subtitle of host publicationApplications and Technology, CLEO_AT 2019
PublisherOptica Publishing Group (formerly OSA)
ISBN (Print)9781943580576
DOIs
StatePublished - 2019
EventCLEO: Applications and Technology, CLEO_AT 2019 - San Jose, United States
Duration: May 5 2019May 10 2019

Publication series

NameOptics InfoBase Conference Papers
VolumePart F127-CLEO_AT 2019
ISSN (Electronic)2162-2701

Conference

ConferenceCLEO: Applications and Technology, CLEO_AT 2019
Country/TerritoryUnited States
CitySan Jose
Period5/5/195/10/19

Funding

This work was funded by SFI grant no. SFI/12/RC/2278, and ASRC. AKPL acknowledges support from the U.S. DOE Office of Science, Office of Basic Energy Sciences, Materials Science and Engineering Division.

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials

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