TY - GEN
T1 - A Comparison of Metal Adhesion Layers for Au Films in Thermo-Plasmonic Applications
AU - Abbott, William M.
AU - Murray, Christopher P.
AU - Lochlainn, Sorcha Ni
AU - Bello, Frank
AU - Zhong, Chuan
AU - Smith, Christopher
AU - Petford-Long, Amanda K.
AU - Donegan, John F.
AU - McCloskey, David
N1 - Publisher Copyright:
© 2019 OSA.
PY - 2019/5
Y1 - 2019/5
N2 - The dewetting resistance of Au 50 nm films fabricated atop Ti/Ta/W/Cr/Al adhesion layers (0.5-5 nm) was investigated. Results show sub-nanometer Ta has superior stability under thermal stress, while W and Ti show best plasmonic response.
AB - The dewetting resistance of Au 50 nm films fabricated atop Ti/Ta/W/Cr/Al adhesion layers (0.5-5 nm) was investigated. Results show sub-nanometer Ta has superior stability under thermal stress, while W and Ti show best plasmonic response.
UR - http://www.scopus.com/inward/record.url?scp=85069148924&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85069148924&partnerID=8YFLogxK
U2 - 10.23919/CLEO.2019.8749722
DO - 10.23919/CLEO.2019.8749722
M3 - Conference contribution
AN - SCOPUS:85069148924
T3 - 2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings
BT - 2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 Conference on Lasers and Electro-Optics, CLEO 2019
Y2 - 5 May 2019 through 10 May 2019
ER -