A constitutive model for a high lead solder

Shengmin Wen*, Leon M. Keer, Semyon Vaynman, Lawrence R. Lawson

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

26 Scopus citations

Abstract

High lead solders have been widely used in chip scale packaging. This paper presents a comprehensive study of the various properties, such as Young's moduli, creep, plasticity, cyclic hardening and softening, fatigue, etc., of a typical high lead solder, 96.5Pb-3.5Sn. Based on these studies, a unified creep and plasticity approach, incorporating damage, is adopted to construct a three-dimensional constitutive model for this solder. The model is then used to simulate cyclic hardening and softening behavior, isothermal and nonisothermal loading, and damage during the fatigue process. Experimental results from uniaxial tension tests are used to verify the model and good agreement has been achieved.

Original languageEnglish (US)
Pages (from-to)23-31
Number of pages9
JournalIEEE Transactions on Components and Packaging Technologies
Volume25
Issue number1
DOIs
StatePublished - Mar 1 2002

Keywords

  • Constitutive modeling
  • Creep
  • Damage model
  • High lead solder
  • Inelasticity
  • Material properties
  • Plasticity

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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