Abstract
High lead solders have been widely used in chip scale packaging. This paper presents a comprehensive study of the various properties, such as Young's moduli, creep, plasticity, cyclic hardening and softening, fatigue, etc., of a typical high lead solder, 96.5Pb-3.5Sn. Based on these studies, a unified creep and plasticity approach, incorporating damage, is adopted to construct a three-dimensional constitutive model for this solder. The model is then used to simulate cyclic hardening and softening behavior, isothermal and nonisothermal loading, and damage during the fatigue process. Experimental results from uniaxial tension tests are used to verify the model and good agreement has been achieved.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 23-31 |
| Number of pages | 9 |
| Journal | IEEE Transactions on Components and Packaging Technologies |
| Volume | 25 |
| Issue number | 1 |
| DOIs | |
| State | Published - Mar 2002 |
| Externally published | Yes |
Funding
Manuscript received February 7, 2001; revised July 30, 2001. This work was supported by Advanced Micro Devices, Inc., under Contract 99-NJ-654 with the Semiconductor Research Corporation and Toshio Mura Fellowship in Micromechanics from Northwestern University. This work was recommended for publication by Associate Editor R. Chanchani upon evaluation of the reviewers’ comments.
Keywords
- Constitutive modeling
- Creep
- Damage model
- High lead solder
- Inelasticity
- Material properties
- Plasticity
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering