A contactless method for the directed formation of submicrometer copper wires

Jean Claude Bradley*, Jeffrey Crawford, Michael McGee, Samuel G. Stephens

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

22 Scopus citations

Abstract

We report the growth of the submicrometer wires onto copper particles a few micrometers in diameter without the use of photolithography, templates, or physical contact to an external circuit. The wires were grown by a spatially coupled electrodissolution and electrodeposition mechanism directed by the action of an electric field. Scanning electron micrographs of the wires indicate that they are composed of ropelike deposits as small as 0.3 μm in diameter. The ability to form such miniature structures at a predictable location on the particle surface relies on the toposelective (site-selective) interaction of the electric field with the particles. These results may point to a novel method for constructing submicrometer electronic devices.

Original languageEnglish (US)
JournalJournal of the Electrochemical Society
Volume145
Issue number3
StatePublished - Mar 1998

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

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