A coupled thermo-electrical finite element analysis of Pb-free solder joints with interfacial crack propagation

Yao Yao*, Leon M Keer

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A coupled thermo-electrical finite element analysis has been conducted to predict the electrical concentration and joule heating effects on the failure of solder joints under different current densities. The temperature and current density distribution in a solder joint with a crack propagates near the interface of the bulk solder and intermetallic layer has been predicted. The effects of different thermal and electrical conductivities of solder and intermetallic materials on interfacial crack tip temperature are analyzed. Pronounced temperature and electrical current concentration is observed near the crack tip. Although the Pb-free solder is usually regarded has having a higher melting temperature compared with Pb-rich solder, the concentration of heat near the crack tip caused by joule heating may still melt the solder material under high current density. The propagation of crack will be enhanced and cause a circuit failure.

Original languageEnglish (US)
Title of host publicationMaterials Science and Technology Conference and Exhibition 2010, MS and T'10
Pages605-613
Number of pages9
Volume1
StatePublished - Dec 1 2010
EventMaterials Science and Technology Conference and Exhibition 2010, MS and T'10 - Houston, TX, United States
Duration: Oct 17 2010Oct 21 2010

Other

OtherMaterials Science and Technology Conference and Exhibition 2010, MS and T'10
Country/TerritoryUnited States
CityHouston, TX
Period10/17/1010/21/10

Keywords

  • Crack
  • Electrical current
  • Finite element
  • Interface
  • Joules heating
  • Solder

ASJC Scopus subject areas

  • Materials Science (miscellaneous)

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