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A Cu interconnect process for the 130 nm process technology node
Peter Moon*, C. Allen, N. Anand, D. Austin, T. Bramblett, M. Fradkin, S. Fu, M. Hussein, J. Jeong, C. Lo, A. Ott, P. Smith, L. Rumaner
*Corresponding author for this work
Research output: Contribution to journal › Conference article › peer-review
4
Scopus
citations