A deterministic semi-analytical model for the contact of a wafer and a rough Bi-layer pad in CMP

Chengjiao Yu, Zhanjiang Wang, Fred Sun, Shaoning Lu, Leon M Keer, Q Jane Wang

Research output: Contribution to journalArticle

11 Scopus citations

Abstract

Precise understanding of the pad-wafer contact is needed for designing polishing pads and planarization processes. This paper presents a deterministic semi-analytical model for investigating the elastic contact between a rough bi-layer porous body (pad) and a rigid plane (wafer). Homogenized or equivalent material properties are obtained and utilized for modeling each layer. The frequency response functions (FRF) for contact involving a bi-layer material, based on the Papkovich-Neuber potentials, are used, and the model is solved with the conjugate gradient method (CGM) and a fast Fourier transform (FFT) approach. The simulated pad-wafer contact areas are compared with the results from optical contact measurements for model verification. The application region of the bi-layered model is determined, and a map for the use of the bi-layer contact model is generated. The impacts of materials and layer thicknesses on contact ratio are analyzed.

Original languageEnglish (US)
JournalECS Journal of Solid State Science and Technology
Volume2
Issue number9
DOIs
StatePublished - Nov 15 2013

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

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