A fatigue theory for solders

S. Wen*, Leon M Keer

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review


A fatigue theory with its definition of fatigue criterion based on physical damage mechanisms is presented for solders. The theory applies Mura's micromechanical fatigue model to each individual grain of the solder structure, where grain's crystallographic orientation is taken into account. A solder structure is defined as fatigued when the ratio of its failed grains reaches a critical percolation threshold, since at this point the failed grains may form a large cluster. Experimental data for 96.5Pb-3.5Sn solder showed good agreement with the prediction by the theory and its failure criterion. The theory is anisotropic, and thus there is no size limitation to its application, making it applicable to anisotropic small-scale (micron scale or smaller) solder joints.

Original languageEnglish (US)
Pages (from-to)120-127
Number of pages8
JournalAnnual Proceedings - Reliability Physics (Symposium)
StatePublished - Jan 1 2001
Event39th Annual International Reliability Physics Symposium - Orlando, FL, United States
Duration: Apr 30 2001May 3 2001


  • Anisotropic
  • Fatigue
  • Micromechanics
  • Percolation
  • Size effect
  • Solders

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality


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