A fatigue theory for solders

Shengmin Wen, L. M. Keer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations


A fatigue theory with its definition of fatigue failure criterion based on physical damage mechanisms is presented for solders. The theory applies Mura's micromechanical fatigue model to each individual grain of the solder structure, where grain's crystallographic orientation is taken into account. A solder structure is defined as fatigued when the ratio of its failed grains reaches a critical percolation threshold, since at this point the failed grains may form a large cluster. Experimental data for 96.5Pb-3.5Sn solder showed good agreement with prediction by the theory and its failure criterion. The theory is anisotropic, and thus there is no size limitation to its application, making it applicable to anisotropic small-scale (micron scale or smaller) solder joints.

Original languageEnglish (US)
Title of host publication2001 IEEE International Reliability Physics Symposium Proceedings - 39th Annual
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages8
ISBN (Electronic)0780365879
StatePublished - 2001
Externally publishedYes
Event39th Annual IEEE International Reliability Physics Symposium, IRPS 2001 - Orlando, United States
Duration: Apr 30 2001May 3 2001

Publication series

NameIEEE International Reliability Physics Symposium Proceedings
ISSN (Print)1541-7026


Other39th Annual IEEE International Reliability Physics Symposium, IRPS 2001
Country/TerritoryUnited States


  • Anisotropic magnetoresistance
  • Capacitive sensors
  • Civil engineering
  • Fatigue
  • Micromechanical devices
  • Optical microscopy
  • Scanning electron microscopy
  • Soldering
  • Surface cracks
  • Testing

ASJC Scopus subject areas

  • General Engineering


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