A Generic Soft Encapsulation Strategy for Stretchable Electronics

Kan Li, Xu Cheng, Feng Zhu, Linze Li, Zhaoqian Xie, Haiwen Luan, Zhouheng Wang, Ziyao Ji, Heling Wang, Fei Liu, Yeguang Xue, Changqing Jiang, Xue Feng, Luming Li, John A Rogers, Yonggang Huang, Yihui Zhang

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Recent progress in stretchable forms of inorganic electronic systems has established a route to new classes of devices, with particularly unique capabilities in functional biointerfaces, because of their mechanical and geometrical compatibility with human tissues and organs. A reliable approach to physically and chemically protect the electronic components and interconnects is indispensable for practical applications. Although recent reports describe various options in soft, solid encapsulation, the development of approaches that do not significantly reduce the stretchability remains an area of continued focus. Herein, a generic, soft encapsulation strategy is reported, which is applicable to a wide range of stretchable interconnect designs, including those based on two-dimensional (2D) serpentine configurations, 2D fractal-inspired patterns, and 3D helical configurations. This strategy forms the encapsulation while the system is in a prestrained state, in contrast to the traditional approach that involves the strain-free configuration. A systematic comparison reveals that substantial enhancements (e.g., ≈6.0 times for 2D serpentine, ≈4.0 times for 2D fractal, and ≈2.6 times for 3D helical) in the stretchability can be achieved through use of the proposed strategy. Demonstrated applications in highly stretchable light-emitting diodes systems that can be mounted onto complex curvilinear surfaces illustrate the general capabilities in functional device systems.

Original languageEnglish (US)
Article number1806630
JournalAdvanced Functional Materials
Volume29
Issue number8
DOIs
StatePublished - Feb 21 2019

Fingerprint

Encapsulation
Electronic equipment
Fractals
fractals
configurations
electronics
organs
compatibility
Light emitting diodes
light emitting diodes
routes
Tissue
augmentation

Keywords

  • buckling
  • encapsulation method
  • soft elastomers
  • stretchable electronics
  • two-stage encapsulation

ASJC Scopus subject areas

  • Chemistry(all)
  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Li, K., Cheng, X., Zhu, F., Li, L., Xie, Z., Luan, H., ... Zhang, Y. (2019). A Generic Soft Encapsulation Strategy for Stretchable Electronics. Advanced Functional Materials, 29(8), [1806630]. https://doi.org/10.1002/adfm.201806630
Li, Kan ; Cheng, Xu ; Zhu, Feng ; Li, Linze ; Xie, Zhaoqian ; Luan, Haiwen ; Wang, Zhouheng ; Ji, Ziyao ; Wang, Heling ; Liu, Fei ; Xue, Yeguang ; Jiang, Changqing ; Feng, Xue ; Li, Luming ; Rogers, John A ; Huang, Yonggang ; Zhang, Yihui. / A Generic Soft Encapsulation Strategy for Stretchable Electronics. In: Advanced Functional Materials. 2019 ; Vol. 29, No. 8.
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author = "Kan Li and Xu Cheng and Feng Zhu and Linze Li and Zhaoqian Xie and Haiwen Luan and Zhouheng Wang and Ziyao Ji and Heling Wang and Fei Liu and Yeguang Xue and Changqing Jiang and Xue Feng and Luming Li and Rogers, {John A} and Yonggang Huang and Yihui Zhang",
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Li, K, Cheng, X, Zhu, F, Li, L, Xie, Z, Luan, H, Wang, Z, Ji, Z, Wang, H, Liu, F, Xue, Y, Jiang, C, Feng, X, Li, L, Rogers, JA, Huang, Y & Zhang, Y 2019, 'A Generic Soft Encapsulation Strategy for Stretchable Electronics' Advanced Functional Materials, vol. 29, no. 8, 1806630. https://doi.org/10.1002/adfm.201806630

A Generic Soft Encapsulation Strategy for Stretchable Electronics. / Li, Kan; Cheng, Xu; Zhu, Feng; Li, Linze; Xie, Zhaoqian; Luan, Haiwen; Wang, Zhouheng; Ji, Ziyao; Wang, Heling; Liu, Fei; Xue, Yeguang; Jiang, Changqing; Feng, Xue; Li, Luming; Rogers, John A; Huang, Yonggang; Zhang, Yihui.

In: Advanced Functional Materials, Vol. 29, No. 8, 1806630, 21.02.2019.

Research output: Contribution to journalArticle

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T1 - A Generic Soft Encapsulation Strategy for Stretchable Electronics

AU - Li, Kan

AU - Cheng, Xu

AU - Zhu, Feng

AU - Li, Linze

AU - Xie, Zhaoqian

AU - Luan, Haiwen

AU - Wang, Zhouheng

AU - Ji, Ziyao

AU - Wang, Heling

AU - Liu, Fei

AU - Xue, Yeguang

AU - Jiang, Changqing

AU - Feng, Xue

AU - Li, Luming

AU - Rogers, John A

AU - Huang, Yonggang

AU - Zhang, Yihui

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N2 - Recent progress in stretchable forms of inorganic electronic systems has established a route to new classes of devices, with particularly unique capabilities in functional biointerfaces, because of their mechanical and geometrical compatibility with human tissues and organs. A reliable approach to physically and chemically protect the electronic components and interconnects is indispensable for practical applications. Although recent reports describe various options in soft, solid encapsulation, the development of approaches that do not significantly reduce the stretchability remains an area of continued focus. Herein, a generic, soft encapsulation strategy is reported, which is applicable to a wide range of stretchable interconnect designs, including those based on two-dimensional (2D) serpentine configurations, 2D fractal-inspired patterns, and 3D helical configurations. This strategy forms the encapsulation while the system is in a prestrained state, in contrast to the traditional approach that involves the strain-free configuration. A systematic comparison reveals that substantial enhancements (e.g., ≈6.0 times for 2D serpentine, ≈4.0 times for 2D fractal, and ≈2.6 times for 3D helical) in the stretchability can be achieved through use of the proposed strategy. Demonstrated applications in highly stretchable light-emitting diodes systems that can be mounted onto complex curvilinear surfaces illustrate the general capabilities in functional device systems.

AB - Recent progress in stretchable forms of inorganic electronic systems has established a route to new classes of devices, with particularly unique capabilities in functional biointerfaces, because of their mechanical and geometrical compatibility with human tissues and organs. A reliable approach to physically and chemically protect the electronic components and interconnects is indispensable for practical applications. Although recent reports describe various options in soft, solid encapsulation, the development of approaches that do not significantly reduce the stretchability remains an area of continued focus. Herein, a generic, soft encapsulation strategy is reported, which is applicable to a wide range of stretchable interconnect designs, including those based on two-dimensional (2D) serpentine configurations, 2D fractal-inspired patterns, and 3D helical configurations. This strategy forms the encapsulation while the system is in a prestrained state, in contrast to the traditional approach that involves the strain-free configuration. A systematic comparison reveals that substantial enhancements (e.g., ≈6.0 times for 2D serpentine, ≈4.0 times for 2D fractal, and ≈2.6 times for 3D helical) in the stretchability can be achieved through use of the proposed strategy. Demonstrated applications in highly stretchable light-emitting diodes systems that can be mounted onto complex curvilinear surfaces illustrate the general capabilities in functional device systems.

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KW - encapsulation method

KW - soft elastomers

KW - stretchable electronics

KW - two-stage encapsulation

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