A microelectromechanical load sensor for in situ electron and x-ray microscopy tensile testing of nanostructures

Yong Zhu, N. Moldovan, Horacio D. Espinosa*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

116 Scopus citations

Abstract

We report on the performance of a microelectromechanical system (MEMS) designed for the in situ electron and x-ray microscopy tensile testing of nanostructures, e.g., carbon nanotubes and nanowires. The device consists of an actuator and a load sensor with a gap in between, across which nanostructures can be placed, nanowelded, and mechanically tested. The load sensor is based on differential capacitance measurements, from which its displacement history is recorded. By determining the sensor stiffness, the load history during the testing is obtained. We calibrated the device and examined its resolution in the context of various applications of interest. The device is the first true MEMS in which the load is electronically measured. It is designed to be placed in scanning and transmission electron microscopes and on x-ray synchrotron stages.

Original languageEnglish (US)
Article number013506
Pages (from-to)013506-1-013506-3
JournalApplied Physics Letters
Volume86
Issue number1
DOIs
StatePublished - Jan 2005

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Fingerprint Dive into the research topics of 'A microelectromechanical load sensor for in situ electron and x-ray microscopy tensile testing of nanostructures'. Together they form a unique fingerprint.

Cite this