A micromechanical model considering dislocation density based intra-granular backstress under cyclic loading

Keyphrases

• Cyclic Loading 100%
• Micromechanical Modeling 100%
• Density-based 100%
• Dislocation Density 100%
• Back Stress 100%
• Strain Rate 66%
• Temperature Rate 66%
• Dislocation 33%
• System Level 33%
• Polycrystalline Materials 33%
• Small Strain 33%
• Solder Alloys 33%
• Slip System 33%
• Eshelby Inclusion 33%
• Body-centered Tetragonal 33%
• Strain Path Change 33%
• Bauschinger Effect 33%
• Ag3Sn 33%
• Body-centered Cubic Structure 33%
• Cyclic Stress-strain Curve 33%
• Sn-3.0Ag-0.5Cu Solder 33%
• Elastic Plastic Self-consistent Model 33%
• Armstrong-Frederick 33%
• Dislocation Annihilation 33%
• Dislocation Storage 33%
• Cyclic Loading Experiment 33%
• 9Cr-1Mo Steel 33%
• Inclusion Analysis 33%

Engineering

• Dislocation Density 100%
• Micromechanical Model 100%
• Cyclic Loading 100%
• Strain Rate 66%
• Constitutive Model 33%
• Stress-Strain Curve 33%
• Cyclic Stress 33%
• Elastic Strain 33%
• Slip System 33%
• Body-Centered Cubic 33%
• Strain Path Change 33%
• Body-Centered Tetragonal 33%
• Polycrystalline Material 33%
• Bauschinger Effect 33%
• Centered Cubic Structure 33%