A new metamaterial for MRI-safe deep brain stimulation leads

Francesca Marturano*, Laleh Golestanirad, Giorgio Bonmassar

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Deep Brain Stimulation (DBS) leads have become a valuable tool in neuroscience for diagnosing and treating various neurological conditions, including Parkinson's disease [1]. However, commercially available leads have limited compatibility with magnetic resonance imaging (MRI), hindering the possibility for patients with intracranial implants to benefit from the diagnostic potential of functional MRI [2]. Therefore, the development of MRI-safe DBS leads is necessary to promote new advances in the field. Here, we propose a novel technology to fabricate the internal microwires of DBS leads, that was specifically designed to ensure safe operation with MRI up to 3T. The technology is designed to include a steep interface between two segments of metals that are layered onto a non-conductive substrate. The abrupt resistance variation at the interface breaks up the RF-induced current, reducing distal electrode heating, specific absorption rate (SAR), and MRI artifacts [3].

Original languageEnglish (US)
Title of host publication2023 International Conference on Electromagnetics in Advanced Applications, ICEAA 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages407
Number of pages1
ISBN (Electronic)9798350320589
DOIs
StatePublished - 2023
Event25th International Conference on Electromagnetics in Advanced Applications, ICEAA 2023 - Venice, Italy
Duration: Oct 9 2023Oct 13 2023

Publication series

Name2023 International Conference on Electromagnetics in Advanced Applications, ICEAA 2023

Conference

Conference25th International Conference on Electromagnetics in Advanced Applications, ICEAA 2023
Country/TerritoryItaly
CityVenice
Period10/9/2310/13/23

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Control and Optimization
  • Instrumentation
  • Atomic and Molecular Physics, and Optics
  • Computer Networks and Communications

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