A new methodology to investigate fracture toughness of freestanding MEMS and advanced materials in thin film form

Horacio D. Espinosa*, Bei Peng

*Corresponding author for this work

Research output: Contribution to journalArticle

47 Scopus citations

Abstract

This paper presents a novel membrane deflection fracture experiment (MDFE) to investigate the fracture toughness of microelectromechanical systems (MEMS) and other advanced materials in thin film form. It involves the stretching of freestanding thin-film membranes, in a fixed-fixed configuration, containing preexisting cracks. The fracture behavior of ultrananocrystalline diamond (UNCD), a material developed at Argonne National Laboratory, is investigated to illustrate the methodology. When the fracture initiates from sharp cracks, produced by indentation, the fracture toughness was found to be 4.5 ± 0.25 MP m1/ 2. When the fracture initiates from blunt notches with radii about 100 nm, machined by focused ion beam (FIB), the mean value of the apparent fracture toughness was found to be 6.9 MPa m1/2. Comparison of these two values, using the model proposed by Drory et al. [9], provides a correction factor of two-thirds, which corresponds to a mean value of p/2χ = 1/2.

Original languageEnglish (US)
Pages (from-to)153-159
Number of pages7
JournalJournal of Microelectromechanical Systems
Volume14
Issue number1
DOIs
StatePublished - Feb 1 2005

Keywords

  • Fracture toughness
  • Microelectromechanical systems (MEMS)
  • Thin films
  • Ultrananocrystalline diamond

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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