Recently, a laser-based ultrasonic method known as impulsive stimulated thermal scattering has been developed for rapid, noninvasive noncontact in situ evaluation of thin films and multilayer assemblies. Here we summarize the capabilities of this technique and describe an industrially viable analytical instrument based on this technology.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering