TY - GEN
T1 - A novel MEMS-based nanoscale material testing system
AU - Espinosa, Horacio D.
AU - Zhu, Yong
AU - Corigliano, Alberto
PY - 2006/12/1
Y1 - 2006/12/1
N2 - This paper describes the design and operation of a novel MEMS-based material testing system used for insitu tensile testing of nanostructures, The device consists of a thermal actuator and a capacitive load sensor with a specimen in between. The best load sensor resolutions were achieved reaching 0.05 fF in capacitance, 1 nm in displacement and 12 nN in load. For the first time, this MEMS-based material testing scheme offers the possibility of continuous observation of the specimen deformation and fracture with sub-nanometer displacement accuracy, while simultaneously measuring the applied load electronically with nano-Newton resolution. The device performance was demonstrated by testing palladium nanowires.
AB - This paper describes the design and operation of a novel MEMS-based material testing system used for insitu tensile testing of nanostructures, The device consists of a thermal actuator and a capacitive load sensor with a specimen in between. The best load sensor resolutions were achieved reaching 0.05 fF in capacitance, 1 nm in displacement and 12 nN in load. For the first time, this MEMS-based material testing scheme offers the possibility of continuous observation of the specimen deformation and fracture with sub-nanometer displacement accuracy, while simultaneously measuring the applied load electronically with nano-Newton resolution. The device performance was demonstrated by testing palladium nanowires.
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U2 - 10.1109/ESIME.2006.1644064
DO - 10.1109/ESIME.2006.1644064
M3 - Conference contribution
AN - SCOPUS:33847091280
SN - 1424402751
SN - 9781424402755
T3 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
BT - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
T2 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
Y2 - 24 April 2006 through 26 April 2006
ER -