@inproceedings{5105da9234f548ebba4eda357b7b23a1,
title = "A novel type of ultra-compact lateral-current-injection III/V photonic device integrated on soi for electronic-photonic chip application",
abstract = "An on-chip light source plays a determinant role in the realization of integrated photonic chips for optical interconnects technology. Several integration schemes of III/V laser on SOI platform for on-chip laser application have been proposed and demonstrated. However, most of those integration approaches do not provide effective solutions for the following two problems: effective light confinement/amplification in the III/V active region; and efficient light transfer/coupling between silicon and III/V waveguide. In this paper, a novel approach to integrate an ultra-compact Lateral-Current-Injection (LCI) laser on silicon-on-insulator (SOI) platform by direct wafer bonding technique is proposed and designed. The proposed LCI device has an ultra-thin thickness of 270 nm which is ∼10 times thinner than the vertical current injection laser bonded on silicon. It has a confinement factor in the active region larger than 40% for 1 μm wide III/V active waveguide, which is the highest among all the other integration schemes proposed so far. An optical vertical interconnect access to transfer light efficiently between III/V and silicon layer is designed. The design of the shortest Optical Via of 4 μm which gives ∼100% coupling efficiency is presented.",
author = "Jing Pu and Qian Wang and Ho, {Seng Tiong}",
year = "2013",
doi = "10.1117/12.2001475",
language = "English (US)",
isbn = "9780819493989",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
booktitle = "Silicon Photonics VIII",
note = "Silicon Photonics VIII ; Conference date: 04-02-2013 Through 06-02-2013",
}