Abstract
Insulating polymer composites with conductive filler particles are attractive for sensor applications due to their large piezoresistive response. Composite samples composed of a polymer matrix filled with particles of doped semiconductor that gives a piezoresistive response that is 105 times larger than that of bulk semiconductor sensors are prepared here. The piezoresistance of such composite materials is typically described by using a tunneling mechanism. However, it is found that a percolation description not only fits prior data better but provides a much simpler physical mechanism for the more flexible and soft polymer composite prepared and tested in this study. A simple model for the resistance as a function of applied pressure is derived using percolation theory with a conductivity exponent, s. The model is shown to fit experimental piezoresistive trends with the resistance measured both perpendicular and parallel to the pressure direction.
Original language | English (US) |
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Article number | 1800125 |
Journal | Advanced Theory and Simulations |
Volume | 2 |
Issue number | 2 |
DOIs | |
State | Published - Feb 1 2019 |
Keywords
- percolation theory
- piezoresistive response
- piezoresistivity
- polymer composite
- pressure sensor
ASJC Scopus subject areas
- General
- Modeling and Simulation
- Numerical Analysis
- Statistics and Probability