A Percolation Model for Piezoresistivity in Conductor–Polymer Composites

Mingyi Wang; Ramya Gurunathan; Kazuki Imasato; Nicholas R. Geisendorfer; Adam E. Jakus; Jun Peng; Ramille N. Shah; Matthew Grayson; G. Jeffrey Snyder

doi:10.1002/adts.201800125

A Percolation Model for Piezoresistivity in Conductor–Polymer Composites

Mingyi Wang, Ramya Gurunathan, Kazuki Imasato, Nicholas R. Geisendorfer, Adam E. Jakus, Jun Peng^*, Ramille N. Shah, Matthew Grayson, G. Jeffrey Snyder

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

3 Scopus citations

Abstract

Insulating polymer composites with conductive filler particles are attractive for sensor applications due to their large piezoresistive response. Composite samples composed of a polymer matrix filled with particles of doped semiconductor that gives a piezoresistive response that is 10⁵ times larger than that of bulk semiconductor sensors are prepared here. The piezoresistance of such composite materials is typically described by using a tunneling mechanism. However, it is found that a percolation description not only fits prior data better but provides a much simpler physical mechanism for the more flexible and soft polymer composite prepared and tested in this study. A simple model for the resistance as a function of applied pressure is derived using percolation theory with a conductivity exponent, s. The model is shown to fit experimental piezoresistive trends with the resistance measured both perpendicular and parallel to the pressure direction.

Original language	English (US)
Article number	1800125
Journal	Advanced Theory and Simulations
Volume	2
Issue number	2
DOIs	https://doi.org/10.1002/adts.201800125
State	Published - Feb 1 2019

Keywords

percolation theory
piezoresistive response
piezoresistivity
polymer composite
pressure sensor

ASJC Scopus subject areas

General
Modeling and Simulation
Numerical Analysis
Statistics and Probability

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title = "A Percolation Model for Piezoresistivity in Conductor–Polymer Composites",

abstract = "Insulating polymer composites with conductive filler particles are attractive for sensor applications due to their large piezoresistive response. Composite samples composed of a polymer matrix filled with particles of doped semiconductor that gives a piezoresistive response that is 105 times larger than that of bulk semiconductor sensors are prepared here. The piezoresistance of such composite materials is typically described by using a tunneling mechanism. However, it is found that a percolation description not only fits prior data better but provides a much simpler physical mechanism for the more flexible and soft polymer composite prepared and tested in this study. A simple model for the resistance as a function of applied pressure is derived using percolation theory with a conductivity exponent, s. The model is shown to fit experimental piezoresistive trends with the resistance measured both perpendicular and parallel to the pressure direction.",

keywords = "percolation theory, piezoresistive response, piezoresistivity, polymer composite, pressure sensor",

author = "Mingyi Wang and Ramya Gurunathan and Kazuki Imasato and Geisendorfer, {Nicholas R.} and Jakus, {Adam E.} and Jun Peng and Shah, {Ramille N.} and Matthew Grayson and Snyder, {G. Jeffrey}",

note = "Funding Information: This work was conducted under DARPA SEED HR00111710005 and made use of the EPIC facility of Northwestern University's NUANCE Center, which has received support from the Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource (NSF ECCS-1542205). N.R.G. was supported by a NASA Space Technology Research Fellowship. M.W. gratefully acknowledges help from Prof. Lidong Chen of SIC-CAS, Dr. Stephen D. Kang of Stanford University, Max Wood of Snyder Group of Northwestern University, Dr. Yue Lin of Cambridge University, Dr. Mengdi Han of Rogers Group of Northwestern University, Jilong Ye of Tsinghua University, Jack Dongliang Shi of HK PloyU, and Cheng Chang of Beihang University.",

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A Percolation Model for Piezoresistivity in Conductor–Polymer Composites. / Wang, Mingyi; Gurunathan, Ramya; Imasato, Kazuki; Geisendorfer, Nicholas R.; Jakus, Adam E.; Peng, Jun; Shah, Ramille N.; Grayson, Matthew ; Snyder, G. Jeffrey.

In: Advanced Theory and Simulations, Vol. 2, No. 2, 1800125, 01.02.2019.

Research output: Contribution to journal › Article › peer-review

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AB - Insulating polymer composites with conductive filler particles are attractive for sensor applications due to their large piezoresistive response. Composite samples composed of a polymer matrix filled with particles of doped semiconductor that gives a piezoresistive response that is 105 times larger than that of bulk semiconductor sensors are prepared here. The piezoresistance of such composite materials is typically described by using a tunneling mechanism. However, it is found that a percolation description not only fits prior data better but provides a much simpler physical mechanism for the more flexible and soft polymer composite prepared and tested in this study. A simple model for the resistance as a function of applied pressure is derived using percolation theory with a conductivity exponent, s. The model is shown to fit experimental piezoresistive trends with the resistance measured both perpendicular and parallel to the pressure direction.

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