A photocurable poly(dimethylsiloxane) chemistry designed for soft lithographic molding and printing in the nanometer regime

Kyung M. Choi, John A. Rogers*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

274 Scopus citations

Abstract

Patterning techniques that rely on high-resolution elastomeric elements such as stamps, molds, and conformable photomasks are operationally simple methods for nanofabrication that may find applications in areas such as molecular and organic electronics. The resolution of these "soft" lithographic procedures is often limited by the mechanical properties of the elastomers. We introduce here a chemically modified poly(dimethylsiloxane) material that is designed and optimized specifically for soft lithography, particularly in the nanometer regime. We demonstrate its use for nanopatterning tasks that are challenging with the commercially available elastomers that have been used in the past.

Original languageEnglish (US)
Pages (from-to)4060-4061
Number of pages2
JournalJournal of the American Chemical Society
Volume125
Issue number14
DOIs
StatePublished - Apr 9 2003

ASJC Scopus subject areas

  • Catalysis
  • Chemistry(all)
  • Biochemistry
  • Colloid and Surface Chemistry

Fingerprint Dive into the research topics of 'A photocurable poly(dimethylsiloxane) chemistry designed for soft lithographic molding and printing in the nanometer regime'. Together they form a unique fingerprint.

Cite this