Abstract
This paper demonstrates a new mode of automated micro transfer printing called laser micro transfer printing (LμTP). As a process, micro-transfer printing provides a unique and critical manufacturing route to extracting active microstructures from growth substrates and deterministically assembling them into a variety of functional substrates ranging from polymers to glasses and ceramics and to metallic foils to support applications such as flexible, large-area electronics, concentrating photovoltaics and displays. Laser transfer printing extends micro-transfer printing technology by providing a non-contact approach that is insensitive to the preparation and properties of the receiving substrate. It does so by exploiting the difference in the thermo-mechanical responses of the microstructure and transfer printing stamp materials to drive the release of the microstructure or 'ink' from the stamp and its transfer to substrate. This paper describes the process and the physical phenomena that drive it. It focuses on the use of this knowledge to design and test a print head for the process. The print head is used to demonstrate the new printing capabilities that LμTP enables.
Original language | English (US) |
---|---|
Title of host publication | 40th North American Manufacturing Research Conference 2012 - Transactions of the North American Manufacturing Research Institution of SME |
Pages | 698-707 |
Number of pages | 10 |
Volume | 40 |
State | Published - Nov 28 2012 |
Event | 40th Annual North American Manufacturing Research Conference, NAMRC40 - Notre Dame, IN, United States Duration: Jun 4 2012 → Jun 8 2012 |
Other
Other | 40th Annual North American Manufacturing Research Conference, NAMRC40 |
---|---|
Country/Territory | United States |
City | Notre Dame, IN |
Period | 6/4/12 → 6/8/12 |
Keywords
- Flexible electronics
- Laser delamination
- Micro-transfer printing
- Thermo-mechanical delamination
ASJC Scopus subject areas
- Mechanical Engineering
- Industrial and Manufacturing Engineering