A prototype printer for laser driven micro-transfer printing

Reza Saeidpourazar, Michael D. Sangid, John A. Rogers, Placid M. Ferreira*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution


This paper demonstrates a new mode of automated micro transfer printing called laser micro transfer printing (LμTP). As a process, micro-transfer printing provides a unique and critical manufacturing route to extracting active microstructures from growth substrates and deterministically assembling them into a variety of functional substrates ranging from polymers to glasses and ceramics and to metallic foils to support applications such as flexible, large-area electronics, concentrating photovoltaics and displays. Laser transfer printing extends micro-transfer printing technology by providing a non-contact approach that is insensitive to the preparation and properties of the receiving substrate. It does so by exploiting the difference in the thermo-mechanical responses of the microstructure and transfer printing stamp materials to drive the release of the microstructure or 'ink' from the stamp and its transfer to substrate. This paper describes the process and the physical phenomena that drive it. It focuses on the use of this knowledge to design and test a print head for the process. The print head is used to demonstrate the new printing capabilities that LμTP enables.

Original languageEnglish (US)
Title of host publication40th North American Manufacturing Research Conference 2012 - Transactions of the North American Manufacturing Research Institution of SME
Number of pages10
StatePublished - Nov 28 2012
Event40th Annual North American Manufacturing Research Conference, NAMRC40 - Notre Dame, IN, United States
Duration: Jun 4 2012Jun 8 2012


Other40th Annual North American Manufacturing Research Conference, NAMRC40
Country/TerritoryUnited States
CityNotre Dame, IN


  • Flexible electronics
  • Laser delamination
  • Micro-transfer printing
  • Thermo-mechanical delamination

ASJC Scopus subject areas

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering


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