A realistic design of three-dimensional full cloak at terahertz frequencies

Yongjun Bao; Cheng He; Fan Zhou; Colin Stuart; Cheng Sun

doi:10.1063/1.4735133

A realistic design of three-dimensional full cloak at terahertz frequencies

Yongjun Bao^*, Cheng He, Fan Zhou, Colin Stuart, Cheng Sun

^*Corresponding author for this work

Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

10 Scopus citations

Abstract

This paper presents a realistic design of a three-dimensional invisibility full cloak device at Terahertz frequency, consisting of radially arranged polymer slabs covered with III-V semiconductor materials featuring Drude-like resonance. By applying high order optical transformation, it is possible to constrain the semiconductor layer of constant thickness for the convenience in practical fabrication. The anisotropic and spatially variant material constants are realized by adjusting the filling ratio of the polymer slabs. Such a structure can be readily fabricated using high-aspect ratio three-dimensional microfabrication of polymeric slabs in combine with conformal deposition of the semiconductor cladding layer.

Original language	English (US)
Article number	031910
Journal	Applied Physics Letters
Volume	101
Issue number	3
DOIs	https://doi.org/10.1063/1.4735133
State	Published - Jul 16 2012

ASJC Scopus subject areas

Physics and Astronomy (miscellaneous)

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abstract = "This paper presents a realistic design of a three-dimensional invisibility full cloak device at Terahertz frequency, consisting of radially arranged polymer slabs covered with III-V semiconductor materials featuring Drude-like resonance. By applying high order optical transformation, it is possible to constrain the semiconductor layer of constant thickness for the convenience in practical fabrication. The anisotropic and spatially variant material constants are realized by adjusting the filling ratio of the polymer slabs. Such a structure can be readily fabricated using high-aspect ratio three-dimensional microfabrication of polymeric slabs in combine with conformal deposition of the semiconductor cladding layer.",

author = "Yongjun Bao and Cheng He and Fan Zhou and Colin Stuart and Cheng Sun",

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N2 - This paper presents a realistic design of a three-dimensional invisibility full cloak device at Terahertz frequency, consisting of radially arranged polymer slabs covered with III-V semiconductor materials featuring Drude-like resonance. By applying high order optical transformation, it is possible to constrain the semiconductor layer of constant thickness for the convenience in practical fabrication. The anisotropic and spatially variant material constants are realized by adjusting the filling ratio of the polymer slabs. Such a structure can be readily fabricated using high-aspect ratio three-dimensional microfabrication of polymeric slabs in combine with conformal deposition of the semiconductor cladding layer.

AB - This paper presents a realistic design of a three-dimensional invisibility full cloak device at Terahertz frequency, consisting of radially arranged polymer slabs covered with III-V semiconductor materials featuring Drude-like resonance. By applying high order optical transformation, it is possible to constrain the semiconductor layer of constant thickness for the convenience in practical fabrication. The anisotropic and spatially variant material constants are realized by adjusting the filling ratio of the polymer slabs. Such a structure can be readily fabricated using high-aspect ratio three-dimensional microfabrication of polymeric slabs in combine with conformal deposition of the semiconductor cladding layer.

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A realistic design of three-dimensional full cloak at terahertz frequencies

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