TY - GEN
T1 - A self-adjusting clock tree architecture to cope with temperature variations
AU - Long, Jieyi
AU - Ku, Ja Chun
AU - Memik, Seda Ogrenci
AU - Ismail, Yehea
PY - 2007
Y1 - 2007
N2 - Ensuring resilience against environmental variations is becoming one of the great challenges of chip design. In this paper, we propose a self adjusting clock tree architecture, SACTA, to improve chip performance and reliability in the presence of on-chip temperature variations. SACTA performs temperature dependent dynamic clock skew scheduling to prevent timing violations in a pipelined circuit. We present an automatic temperature adjustable skew buffer design, which enables the adaptive feature of SACTA. Furthermore, we propose an efficient and general optimization framework to determine the configuration of these special delay elements. Experimental results show that a pipeline supported by SACTA is able to prevent thermal induced timing violations within a significantly larger range of operating temperatures (enhancing the violation-free range by as much as 45°C).
AB - Ensuring resilience against environmental variations is becoming one of the great challenges of chip design. In this paper, we propose a self adjusting clock tree architecture, SACTA, to improve chip performance and reliability in the presence of on-chip temperature variations. SACTA performs temperature dependent dynamic clock skew scheduling to prevent timing violations in a pipelined circuit. We present an automatic temperature adjustable skew buffer design, which enables the adaptive feature of SACTA. Furthermore, we propose an efficient and general optimization framework to determine the configuration of these special delay elements. Experimental results show that a pipeline supported by SACTA is able to prevent thermal induced timing violations within a significantly larger range of operating temperatures (enhancing the violation-free range by as much as 45°C).
UR - http://www.scopus.com/inward/record.url?scp=50249122050&partnerID=8YFLogxK
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U2 - 10.1109/ICCAD.2007.4397247
DO - 10.1109/ICCAD.2007.4397247
M3 - Conference contribution
AN - SCOPUS:50249122050
SN - 1424413826
SN - 9781424413829
T3 - IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
SP - 75
EP - 82
BT - 2007 IEEE/ACM International Conference on Computer-Aided Design, ICCAD
T2 - 2007 IEEE/ACM International Conference on Computer-Aided Design, ICCAD
Y2 - 4 November 2007 through 8 November 2007
ER -