A strain-isolation design for stretchable electronics

Jian Wu, Ming Li, Wei Qiu Chen, Dae Hyeong Kim, Yun Soung Kim, Yong Gang Huang*, Keh Chih Hwang, Zhan Kang, John A. Rogers

*Corresponding author for this work

Research output: Contribution to journalArticle

19 Scopus citations

Abstract

Stretchable electronics represents a direction of recent development in next-generation semiconductor devices. Such systems have the potential to offer the performance of conventional wafer-based technologies, but they can be stretched like a rubber band, twisted like a rope, bent over a pencil, and folded like a piece of paper. Isolating the active devices from strains associated with such deformations is an important aspect of design. One strategy involves the shielding of the electronics from deformation of the substrate through insertion of a compliant adhesive layer. This paper establishes a simple, analytical model and validates the results by the finite element method. The results show that a relatively thick, compliant adhesive is effective to reduce the strain in the electronics, as is a relatively short film.

Original languageEnglish (US)
Pages (from-to)881-888
Number of pages8
JournalActa Mechanica Sinica/Lixue Xuebao
Volume26
Issue number6
DOIs
StatePublished - Dec 1 2010

Keywords

  • Adhesive
  • Strain isolation
  • Stretchable electronics
  • Substrate
  • Thin film

ASJC Scopus subject areas

  • Computational Mechanics
  • Mechanical Engineering

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