Abstract
A wireless interconnect technology for high-speed digital circuits employing linear defects in electromagnetic bandgap (EBG) structures, was analyzed. A prototype microwave EBG waveguiding structures with linear double-row defects was constructed and tested. These structures were realized using double-sided circuit board having standard FR4 as the dielectric material. The results which scaled to 10 Ghz verified the feasibility of achieving an approximately 80% bandwidth with excellent stopband, gain flatness, and matching characteristics.
Original language | English (US) |
---|---|
Pages (from-to) | 1523-1526 |
Number of pages | 4 |
Journal | IEEE Antennas and Propagation Society, AP-S International Symposium (Digest) |
Volume | 2 |
DOIs | |
State | Published - 2004 |
Externally published | Yes |
Event | IEEE Antennas and Propagation Society Symposium 2004 Digest held in Conjunction with: USNC/URSI National Radio Science Meeting - Monterey, CA, United States Duration: Jun 20 2004 → Jun 25 2004 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering