A wireless interconnect technology for high-speed digital circuits employing linear defects in electromagnetic bandgap (EBG) structures, was analyzed. A prototype microwave EBG waveguiding structures with linear double-row defects was constructed and tested. These structures were realized using double-sided circuit board having standard FR4 as the dielectric material. The results which scaled to 10 Ghz verified the feasibility of achieving an approximately 80% bandwidth with excellent stopband, gain flatness, and matching characteristics.
|Original language||English (US)|
|Number of pages||4|
|Journal||IEEE Antennas and Propagation Society, AP-S International Symposium (Digest)|
|State||Published - Sep 29 2004|
ASJC Scopus subject areas
- Electrical and Electronic Engineering