A study of a microwave electromagnetic bandgap structure with waveguiding defect for potential use as a bandpass wireless interconnect

J. J. Simpson*, Allen Taflove, J. A. Mix, H. Heck

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

A wireless interconnect technology for high-speed digital circuits employing linear defects in electromagnetic bandgap (EBG) structures, was analyzed. A prototype microwave EBG waveguiding structures with linear double-row defects was constructed and tested. These structures were realized using double-sided circuit board having standard FR4 as the dielectric material. The results which scaled to 10 Ghz verified the feasibility of achieving an approximately 80% bandwidth with excellent stopband, gain flatness, and matching characteristics.

Original languageEnglish (US)
Pages (from-to)1523-1526
Number of pages4
JournalIEEE Antennas and Propagation Society, AP-S International Symposium (Digest)
Volume2
StatePublished - Sep 29 2004

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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