A surface micromachined, out-of-plane anemometer

Jack Chen*, Jun Zou, Chang Liu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Scopus citations

Abstract

A novel out-of-plane hot-wire anemometer has been developed by combining surface micromachining and efficient three-dimensional assembly. The sensing filament is made of metal instead of doped silicon. It is elevated from the substrate using an efficient three-dimensional assembly process, resulting in greater sensitivity. The overall process temperature is low (<250°C). Hence the process can be realized on non-silicon, low-cost and flexible substrates. Time constant in constant-current mode is found to be below 50-μs with a wire thickness of 1000 Å and 50-μm in length.

Original languageEnglish (US)
Title of host publicationProceedings of the IEEE Micro Electro Mechanical Systems (MEMS)
Pages332-335
Number of pages4
StatePublished - Jan 1 2002
Event15th IEEE International Conference on Micro Electro Mechanical Systems MEMS 2002 - Las Vegas, NV, United States
Duration: Jan 20 2002Jan 24 2002

Other

Other15th IEEE International Conference on Micro Electro Mechanical Systems MEMS 2002
CountryUnited States
CityLas Vegas, NV
Period1/20/021/24/02

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Chen, J., Zou, J., & Liu, C. (2002). A surface micromachined, out-of-plane anemometer. In Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS) (pp. 332-335)