A surface micromachined, out-of-plane anemometer

Jack Chen; Jun Zou; Chang Liu

A surface micromachined, out-of-plane anemometer

Jack Chen^*, Jun Zou, Chang Liu

^*Corresponding author for this work

Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

9 Scopus citations

Abstract

A novel out-of-plane hot-wire anemometer has been developed by combining surface micromachining and efficient three-dimensional assembly. The sensing filament is made of metal instead of doped silicon. It is elevated from the substrate using an efficient three-dimensional assembly process, resulting in greater sensitivity. The overall process temperature is low (<250°C). Hence the process can be realized on non-silicon, low-cost and flexible substrates. Time constant in constant-current mode is found to be below 50-μs with a wire thickness of 1000 Å and 50-μm in length.

Original language	English (US)
Title of host publication	Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)
Pages	332-335
Number of pages	4
State	Published - Jan 1 2002
Event	15th IEEE International Conference on Micro Electro Mechanical Systems MEMS 2002 - Las Vegas, NV, United States Duration: Jan 20 2002 → Jan 24 2002

Other

Other	15th IEEE International Conference on Micro Electro Mechanical Systems MEMS 2002
Country/Territory	United States
City	Las Vegas, NV
Period	1/20/02 → 1/24/02

ASJC Scopus subject areas

Control and Systems Engineering
Mechanical Engineering
Electrical and Electronic Engineering

Cite this

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title = "A surface micromachined, out-of-plane anemometer",

abstract = "A novel out-of-plane hot-wire anemometer has been developed by combining surface micromachining and efficient three-dimensional assembly. The sensing filament is made of metal instead of doped silicon. It is elevated from the substrate using an efficient three-dimensional assembly process, resulting in greater sensitivity. The overall process temperature is low (<250°C). Hence the process can be realized on non-silicon, low-cost and flexible substrates. Time constant in constant-current mode is found to be below 50-μs with a wire thickness of 1000 {\AA} and 50-μm in length.",

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year = "2002",

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AU - Zou, Jun

AU - Liu, Chang

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AB - A novel out-of-plane hot-wire anemometer has been developed by combining surface micromachining and efficient three-dimensional assembly. The sensing filament is made of metal instead of doped silicon. It is elevated from the substrate using an efficient three-dimensional assembly process, resulting in greater sensitivity. The overall process temperature is low (<250°C). Hence the process can be realized on non-silicon, low-cost and flexible substrates. Time constant in constant-current mode is found to be below 50-μs with a wire thickness of 1000 Å and 50-μm in length.

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M3 - Conference contribution

AN - SCOPUS:0036118084

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BT - Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

T2 - 15th IEEE International Conference on Micro Electro Mechanical Systems MEMS 2002

Y2 - 20 January 2002 through 24 January 2002

ER -

A surface micromachined, out-of-plane anemometer

Abstract

Other

ASJC Scopus subject areas

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