Abstract
Transfer printing is a volatile tool to retract micro devices from a donor substrate via elastomeric stamps, from which the devices are grown or fabricated, followed by printing to a receiver substrate where the device is assembled to an array for integration in various applications. Among the five approaches of transfer printing summarized in the paper, the viscoelastic property of stamps is widely adopted to modulate the interfacial adhesion between the stamp and devices by applying different pulling speeds. A visco-elastic model for transfer printing is analytically established. It shows that the interfacial adhesion increases with pulling speed, which is verified by the experiments and numerical simulations.
Original language | English (US) |
---|---|
Article number | 041019 |
Journal | Journal of Applied Mechanics, Transactions ASME |
Volume | 80 |
Issue number | 4 |
DOIs | |
State | Published - 2013 |
Keywords
- Interfacial fracture toughness
- Pull-off force
- Pulling speed
- Transfer printing
- Viscoelasticity
ASJC Scopus subject areas
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering