TY - GEN
T1 - ActivePaD surface haptic device
AU - Mullenbach, Joe
AU - Johnson, Dan
AU - Colgate, J. Edward
AU - Peshkin, Michael A.
PY - 2012
Y1 - 2012
N2 - We present a new surface haptic interface that combines a variable friction device (the Large Area TPaD) with an impedance controlled planar mechanism. This device configuration is novel because it allows control of the frictional force in the static friction regime, control of the direction of force in the kinetic friction regime, as well as a degree of control over the transition between the two regimes. The range of operating modes combined with a large force capability make the device an appropriate platform for exploring surface haptic control algorithms. The design of the system is explained, two major categories of control algorithm are introduced, and the implementation of a virtual dimple is discussed. Experimental data are used to compare a virtual dimple to its physical analog, and to reveal areas for improvement.
AB - We present a new surface haptic interface that combines a variable friction device (the Large Area TPaD) with an impedance controlled planar mechanism. This device configuration is novel because it allows control of the frictional force in the static friction regime, control of the direction of force in the kinetic friction regime, as well as a degree of control over the transition between the two regimes. The range of operating modes combined with a large force capability make the device an appropriate platform for exploring surface haptic control algorithms. The design of the system is explained, two major categories of control algorithm are introduced, and the implementation of a virtual dimple is discussed. Experimental data are used to compare a virtual dimple to its physical analog, and to reveal areas for improvement.
UR - http://www.scopus.com/inward/record.url?scp=84860805028&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84860805028&partnerID=8YFLogxK
U2 - 10.1109/HAPTIC.2012.6183823
DO - 10.1109/HAPTIC.2012.6183823
M3 - Conference contribution
AN - SCOPUS:84860805028
SN - 9781467308090
T3 - Haptics Symposium 2012, HAPTICS 2012 - Proceedings
SP - 407
EP - 414
BT - Haptics Symposium 2012, HAPTICS 2012 - Proceedings
T2 - 2012 IEEE Haptics Symposium, HAPTICS 2012
Y2 - 4 March 2012 through 7 March 2012
ER -