Abstract
We describe an adaptive thermal management system for 3D-ICs with stacked DRAM cache memories. We present a detailed analysis of the impact of 3D-IC hotspot aggregation on the refresh behavior of the stacked DRAM-based L3 cache. We also present the consequence of the refresh variation on the overall system performance and cache energy consumption. Our analysis demonstrates that memory intensive applications are influenced more strongly by the DRAM refresh variation. We show that there is an optimal operating point where, with a reduced clock frequency, processor cores would actually recover any performance loss induced by DRAM refresh and at the same time the cache energy consumption could be optimized. We propose a low overhead run-time method that can identify the best CPU frequency modulation factor to cool the system to minimize accelerated refresh rates in the DRAM caches. Our system can provide a customizable trade-off between performance of the processor and energy savings of the memory.
Original language | English (US) |
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Title of host publication | Proceedings of the 54th Annual Design Automation Conference 2017, DAC 2017 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
ISBN (Electronic) | 9781450349277 |
DOIs | |
State | Published - Jun 18 2017 |
Event | 54th Annual Design Automation Conference, DAC 2017 - Austin, United States Duration: Jun 18 2017 → Jun 22 2017 |
Publication series
Name | Proceedings - Design Automation Conference |
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Volume | Part 128280 |
ISSN (Print) | 0738-100X |
Other
Other | 54th Annual Design Automation Conference, DAC 2017 |
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Country/Territory | United States |
City | Austin |
Period | 6/18/17 → 6/22/17 |
Funding
This work was partially supported by the DOE Grant DESC0012531 and NSF Grant CCF-1422489.
Keywords
- 3D-IC
- DRAM
- cache
- low power design
- thermal management
ASJC Scopus subject areas
- Computer Science Applications
- Control and Systems Engineering
- Electrical and Electronic Engineering
- Modeling and Simulation