Abstract
We describe a novel soft-lithographic technique possessing broad utility for the fabrication of large area, nanoscale (∼100 nm) multilayer resist structures on electronic material substrates. This additive patterning method transfers ultrathin poly(dimethylsiloxane) (PDMS) decals to an underlying SiO 2-capped organic planarazation layer. The PDMS patterns serve as a latent image through which high-quality multilayer resist structures can be developed using reactive ion-beam etching.
Original language | English (US) |
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Pages (from-to) | 2533-2537 |
Number of pages | 5 |
Journal | Nano letters |
Volume | 5 |
Issue number | 12 |
DOIs | |
State | Published - Dec 1 2005 |
ASJC Scopus subject areas
- Bioengineering
- Chemistry(all)
- Materials Science(all)
- Condensed Matter Physics
- Mechanical Engineering