Advanced approaches for quantitative characterization of thermal transport properties in soft materials using thin, conformable resistive sensors

Kaitlyn E. Crawford; Yinji Ma; Siddharth Krishnan; Chen Wei; Daniel Capua; Yeguang Xue; Shuai Xu; Zhaoqian Xie; Sang Min Won; Limei Tian; Chad Webb; Yajing Li; Xue Feng; Yonggang Huang; John A. Rogers

doi:10.1016/j.eml.2018.04.002

Advanced approaches for quantitative characterization of thermal transport properties in soft materials using thin, conformable resistive sensors

Kaitlyn E. Crawford^*, Yinji Ma, Siddharth Krishnan, Chen Wei, Daniel Capua, Yeguang Xue, Shuai Xu, Zhaoqian Xie, Sang Min Won, Limei Tian, Chad Webb, Yajing Li, Xue Feng, Yonggang Huang, John A. Rogers

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

25 Scopus citations

Abstract

Noninvasive methods for precise characterization of the thermal properties of soft biological tissues such as the skin can yield vital details about physiological health status including at critical intervals during recovery following skin injury. Here, we introduce quantitative measurement and characterization methods that allow rapid, accurate determination of the thermal conductivity of soft materials using thin, skin-like resistive sensor platforms. Systematic evaluations of skin at eight different locations and of six different synthetic skin-mimicking materials across sensor sizes, measurement times, and surface geometries (planar, highly curvilinear) validate simple scaling laws for data interpretation and parameter extraction. As an example of the possibilities, changes in the thermal properties of skin (volar forearm) can be monitored during recovery from exposure to ultraviolet radiation (sunburn) and to stressors associated with localized heating and cooling. More generally, the results described here facilitate rapid, non-invasive thermal measurements on broad classes of biological and non-biological soft materials.

Original language	English (US)
Pages (from-to)	27-35
Number of pages	9
Journal	Extreme Mechanics Letters
Volume	22
DOIs	https://doi.org/10.1016/j.eml.2018.04.002
State	Published - Jul 2018

Funding

KC, SK, SX, SMW, and YL would like to acknowledge funding support provided by the Center for Bio-integrated Electronics of the Simpson-Querrey Institute at Northwestern University, LT acknowledges support from the Beckman Institute Postdoctoral Fellowship at UIUC, RCW acknowledges support from the National Science Foundation (Grant No. DGE-1144245), YM and XF acknowledge the support from the National Basic Research Program of China (Grant No. 2015CB351900) and National Natural Science Foundation of China (Grant Nos. 11402135, 11320101001), YH acknowledges the support from National Science Foundation (Grant Nos. 1400169, 1534120 and 1635443) and NIH (Grant No. R01EB019337). KC, SK, SX, SMW, and YL would like to acknowledge funding support provided by the Center for Bio-integrated Electronics of the Simpson-Querrey Institute at Northwestern University, LT acknowledges support from the Beckman Institute Postdoctoral Fellowship at UIUC, RCW acknowledges support from the National Science Foundation (Grant No. DGE-1144245 ), YM and XF acknowledge the support from the National Basic Research Program of China (Grant No. 2015CB351900 ) and National Natural Science Foundation of China (Grant Nos. 11402135 , 11320101001 ), YH acknowledges the support from National Science Foundation (Grant Nos. 1400169 , 1534120 and 1635443 ) and NIH (Grant No. R01EB019337 ). Appendix A

Keywords

Epidermal electronics
Erythema
Sunburn
Thermal conductivity
Transient plane source

ASJC Scopus subject areas

Bioengineering
Chemical Engineering (miscellaneous)
Engineering (miscellaneous)
Mechanics of Materials
Mechanical Engineering

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10.1016/j.eml.2018.04.002

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Crawford, K. E., Ma, Y., Krishnan, S., Wei, C., Capua, D., Xue, Y., Xu, S., Xie, Z., Won, S. M., Tian, L., Webb, C., Li, Y., Feng, X., Huang, Y., & Rogers, J. A. (2018). Advanced approaches for quantitative characterization of thermal transport properties in soft materials using thin, conformable resistive sensors. Extreme Mechanics Letters, 22, 27-35. https://doi.org/10.1016/j.eml.2018.04.002

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title = "Advanced approaches for quantitative characterization of thermal transport properties in soft materials using thin, conformable resistive sensors",

abstract = "Noninvasive methods for precise characterization of the thermal properties of soft biological tissues such as the skin can yield vital details about physiological health status including at critical intervals during recovery following skin injury. Here, we introduce quantitative measurement and characterization methods that allow rapid, accurate determination of the thermal conductivity of soft materials using thin, skin-like resistive sensor platforms. Systematic evaluations of skin at eight different locations and of six different synthetic skin-mimicking materials across sensor sizes, measurement times, and surface geometries (planar, highly curvilinear) validate simple scaling laws for data interpretation and parameter extraction. As an example of the possibilities, changes in the thermal properties of skin (volar forearm) can be monitored during recovery from exposure to ultraviolet radiation (sunburn) and to stressors associated with localized heating and cooling. More generally, the results described here facilitate rapid, non-invasive thermal measurements on broad classes of biological and non-biological soft materials.",

keywords = "Epidermal electronics, Erythema, Sunburn, Thermal conductivity, Transient plane source",

author = "Crawford, {Kaitlyn E.} and Yinji Ma and Siddharth Krishnan and Chen Wei and Daniel Capua and Yeguang Xue and Shuai Xu and Zhaoqian Xie and Won, {Sang Min} and Limei Tian and Chad Webb and Yajing Li and Xue Feng and Yonggang Huang and Rogers, {John A.}",

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doi = "10.1016/j.eml.2018.04.002",

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Crawford, KE, Ma, Y, Krishnan, S, Wei, C, Capua, D, Xue, Y, Xu, S, Xie, Z, Won, SM, Tian, L, Webb, C, Li, Y, Feng, X, Huang, Y & Rogers, JA 2018, 'Advanced approaches for quantitative characterization of thermal transport properties in soft materials using thin, conformable resistive sensors', Extreme Mechanics Letters, vol. 22, pp. 27-35. https://doi.org/10.1016/j.eml.2018.04.002

TY - JOUR

T1 - Advanced approaches for quantitative characterization of thermal transport properties in soft materials using thin, conformable resistive sensors

AU - Crawford, Kaitlyn E.

AU - Ma, Yinji

AU - Krishnan, Siddharth

AU - Wei, Chen

AU - Capua, Daniel

AU - Xue, Yeguang

AU - Xu, Shuai

AU - Xie, Zhaoqian

AU - Won, Sang Min

AU - Tian, Limei

AU - Webb, Chad

AU - Li, Yajing

AU - Feng, Xue

AU - Huang, Yonggang

AU - Rogers, John A.

PY - 2018/7

Y1 - 2018/7

N2 - Noninvasive methods for precise characterization of the thermal properties of soft biological tissues such as the skin can yield vital details about physiological health status including at critical intervals during recovery following skin injury. Here, we introduce quantitative measurement and characterization methods that allow rapid, accurate determination of the thermal conductivity of soft materials using thin, skin-like resistive sensor platforms. Systematic evaluations of skin at eight different locations and of six different synthetic skin-mimicking materials across sensor sizes, measurement times, and surface geometries (planar, highly curvilinear) validate simple scaling laws for data interpretation and parameter extraction. As an example of the possibilities, changes in the thermal properties of skin (volar forearm) can be monitored during recovery from exposure to ultraviolet radiation (sunburn) and to stressors associated with localized heating and cooling. More generally, the results described here facilitate rapid, non-invasive thermal measurements on broad classes of biological and non-biological soft materials.

AB - Noninvasive methods for precise characterization of the thermal properties of soft biological tissues such as the skin can yield vital details about physiological health status including at critical intervals during recovery following skin injury. Here, we introduce quantitative measurement and characterization methods that allow rapid, accurate determination of the thermal conductivity of soft materials using thin, skin-like resistive sensor platforms. Systematic evaluations of skin at eight different locations and of six different synthetic skin-mimicking materials across sensor sizes, measurement times, and surface geometries (planar, highly curvilinear) validate simple scaling laws for data interpretation and parameter extraction. As an example of the possibilities, changes in the thermal properties of skin (volar forearm) can be monitored during recovery from exposure to ultraviolet radiation (sunburn) and to stressors associated with localized heating and cooling. More generally, the results described here facilitate rapid, non-invasive thermal measurements on broad classes of biological and non-biological soft materials.

KW - Epidermal electronics

KW - Erythema

KW - Sunburn

KW - Thermal conductivity

KW - Transient plane source

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Advanced approaches for quantitative characterization of thermal transport properties in soft materials using thin, conformable resistive sensors

Abstract

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Keywords

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