An analytical method to predict electromigration-induced finger-shaped void growth in SnAgCu solder interconnect

Yao Yao*, Yuexing Wang, Leon M Keer, Morris E. Fine

*Corresponding author for this work

Research output: Contribution to journalArticle

24 Scopus citations

Abstract

An analytical solution to predict electromigration-induced finger-shaped void growth in SnAgCu solder interconnect is developed based on mass diffusion theory. A quantitative nonlinear relation between the void propagation velocity and the shape evolution parameter is obtained. It is found that a circular void will grow at the lowest velocity, but as it collapses to a finger-shaped void it will grow at a faster velocity that is inversely proportional to the width. The void growth velocity predicted is consistent with the experimental observation.

Original languageEnglish (US)
Pages (from-to)7-10
Number of pages4
JournalScripta Materialia
Volume95
Issue number1
DOIs
StatePublished - Jan 1 2015

Keywords

  • Analytical solution
  • Electromigration
  • High current density
  • Solder
  • Void

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

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