An analytical model for shear-enhanced adhesiveless transfer printing

Huanyu Cheng, Jian Wu, Qingmin Yu, Hyun Joon Kim-Lee, Andrew Carlson, Kevin T. Turner, Keh Chih Hwang, Yonggang Huang*, John A. Rogers

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

47 Scopus citations


Transfer printing is an important technique for assembling micro/nanomaterials on unusual substrates, with promising applications in the fabrication of stretchable and flexible electronics designed for use in areas such as biomedicine. The process involves retrieval of structures (e.g., micro-devices) from their growth (donor) substrate via an elastomeric stamp (i.e., an element with posts on its surface), and then delivers them onto a different (receiver) substrate. An analytical mechanics model is developed to identify the key parameters for a shear-enhanced mode for transfer printing. The results predict that the pull-off force decreases linearly with increasing shear strain in the post, or with shear displacement across the stamp. This prediction agrees well with the experiments.

Original languageEnglish (US)
Pages (from-to)46-49
Number of pages4
JournalMechanics Research Communications
StatePublished - Jul 2012


  • Adhesion
  • Interfacial delamination
  • Shear
  • Transfer printing

ASJC Scopus subject areas

  • Civil and Structural Engineering
  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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