An analytical model of strain isolation for stretchable and flexible electronics

H. Cheng; J. Wu; M. Li; D. H. Kim; Y. S. Kim; Y. Huang; Z. Kang; K. C. Hwang; J. A. Rogers

doi:10.1063/1.3553020

An analytical model of strain isolation for stretchable and flexible electronics

H. Cheng, J. Wu, M. Li, D. H. Kim, Y. S. Kim, Y. Huang^*, Z. Kang, K. C. Hwang, J. A. Rogers

^*Corresponding author for this work

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Abstract

One important aspect of stretchable electronics design is to shield the active devices from strains through insertion of a soft layer between devices and substrate. An analytical model is established, which gives linear dependence of strain isolation on the reciprocal of strain-isolation layer thickness, and the reciprocal of device and substrate stiffness. Strain isolation is also linearly proportional to the shear modulus of strain-isolation layer and square of device length.

Original language	English (US)
Article number	061902
Journal	Applied Physics Letters
Volume	98
Issue number	6
DOIs	https://doi.org/10.1063/1.3553020
State	Published - Feb 7 2011

ASJC Scopus subject areas

Physics and Astronomy (miscellaneous)

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@article{55239855ae9e42d7b555383cff140893,

title = "An analytical model of strain isolation for stretchable and flexible electronics",

abstract = "One important aspect of stretchable electronics design is to shield the active devices from strains through insertion of a soft layer between devices and substrate. An analytical model is established, which gives linear dependence of strain isolation on the reciprocal of strain-isolation layer thickness, and the reciprocal of device and substrate stiffness. Strain isolation is also linearly proportional to the shear modulus of strain-isolation layer and square of device length.",

author = "H. Cheng and J. Wu and M. Li and Kim, {D. H.} and Kim, {Y. S.} and Y. Huang and Z. Kang and Hwang, {K. C.} and Rogers, {J. A.}",

note = "Funding Information: The support from NSF (Grant Nos. DMI-0328162 and ECCS-0824129) is acknowledged. K.C. Hwang acknowledges the support from NSFC, Ministry of Education of China, and National Basic Research Program of China (973 Program, Grant No. 2007CB936803). The first and second authors contributed equally.",

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T1 - An analytical model of strain isolation for stretchable and flexible electronics

AU - Cheng, H.

AU - Wu, J.

AU - Li, M.

AU - Kim, D. H.

AU - Kim, Y. S.

AU - Huang, Y.

AU - Kang, Z.

AU - Hwang, K. C.

AU - Rogers, J. A.

N1 - Funding Information: The support from NSF (Grant Nos. DMI-0328162 and ECCS-0824129) is acknowledged. K.C. Hwang acknowledges the support from NSFC, Ministry of Education of China, and National Basic Research Program of China (973 Program, Grant No. 2007CB936803). The first and second authors contributed equally.

PY - 2011/2/7

Y1 - 2011/2/7

N2 - One important aspect of stretchable electronics design is to shield the active devices from strains through insertion of a soft layer between devices and substrate. An analytical model is established, which gives linear dependence of strain isolation on the reciprocal of strain-isolation layer thickness, and the reciprocal of device and substrate stiffness. Strain isolation is also linearly proportional to the shear modulus of strain-isolation layer and square of device length.

AB - One important aspect of stretchable electronics design is to shield the active devices from strains through insertion of a soft layer between devices and substrate. An analytical model is established, which gives linear dependence of strain isolation on the reciprocal of strain-isolation layer thickness, and the reciprocal of device and substrate stiffness. Strain isolation is also linearly proportional to the shear modulus of strain-isolation layer and square of device length.

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An analytical model of strain isolation for stretchable and flexible electronics

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