An analytical model of strain isolation for stretchable and flexible electronics

H. Cheng, J. Wu, M. Li, D. H. Kim, Y. S. Kim, Y. Huang*, Z. Kang, K. C. Hwang, J. A. Rogers

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

34 Scopus citations

Abstract

One important aspect of stretchable electronics design is to shield the active devices from strains through insertion of a soft layer between devices and substrate. An analytical model is established, which gives linear dependence of strain isolation on the reciprocal of strain-isolation layer thickness, and the reciprocal of device and substrate stiffness. Strain isolation is also linearly proportional to the shear modulus of strain-isolation layer and square of device length.

Original languageEnglish (US)
Article number061902
JournalApplied Physics Letters
Volume98
Issue number6
DOIs
StatePublished - Feb 7 2011

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

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