An analytical model to predict diffusion induced intermetallic compounds growth in Cu-Sn-Cu sandwich structures

Yuexing Wang, Yao Yao*, Leon Keer

*Corresponding author for this work

Research output: Contribution to journalArticle

Abstract

A mass diffusion model is developed to describe the growth kinetics of Cu6Sn5 intermetallic compounds (IMC) in the Cu-Sn-Cu sandwich structure. The proposed model is based on the local interfacial mass conversation law where interfacial Cu/Sn reactions and atomic diffusion are considered. Theoretical analysis shows that the IMC thickness growth is proportional to the square root of the product of the diffusion coefficient and time. The proposed model can explain the polarity effect of electromigration on kinetics of IMC growth where all the parameters have clear physical meaning. The theoretical predictions are compared with experimental results and show reasonable accuracy.

Original languageEnglish (US)
Pages (from-to)33-37
Number of pages5
JournalTheoretical and Applied Mechanics Letters
Volume10
Issue number1
DOIs
StatePublished - Jan 2020

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Keywords

  • Diffusion
  • Electromigration
  • Intermetallic compounds
  • Polarity effect
  • Size effect

ASJC Scopus subject areas

  • Computational Mechanics
  • Environmental Engineering
  • Civil and Structural Engineering
  • Biomedical Engineering
  • Aerospace Engineering
  • Ocean Engineering
  • Mechanics of Materials
  • Mechanical Engineering

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