An analytical model to predict diffusion induced intermetallic compounds growth in Cu-Sn-Cu sandwich structures

Yuexing Wang; Yao Yao; Leon Keer

doi:10.1016/j.taml.2020.01.005

An analytical model to predict diffusion induced intermetallic compounds growth in Cu-Sn-Cu sandwich structures

Yuexing Wang, Yao Yao^*, Leon Keer

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

3 Scopus citations

Abstract

A mass diffusion model is developed to describe the growth kinetics of Cu₆Sn₅ intermetallic compounds (IMC) in the Cu-Sn-Cu sandwich structure. The proposed model is based on the local interfacial mass conversation law where interfacial Cu/Sn reactions and atomic diffusion are considered. Theoretical analysis shows that the IMC thickness growth is proportional to the square root of the product of the diffusion coefficient and time. The proposed model can explain the polarity effect of electromigration on kinetics of IMC growth where all the parameters have clear physical meaning. The theoretical predictions are compared with experimental results and show reasonable accuracy.

Original language	English (US)
Pages (from-to)	33-37
Number of pages	5
Journal	Theoretical and Applied Mechanics Letters
Volume	10
Issue number	1
DOIs	https://doi.org/10.1016/j.taml.2020.01.005
State	Published - Jan 2020

Keywords

Diffusion
Electromigration
Intermetallic compounds
Polarity effect
Size effect

ASJC Scopus subject areas

Computational Mechanics
Environmental Engineering
Civil and Structural Engineering
Biomedical Engineering
Aerospace Engineering
Ocean Engineering
Mechanics of Materials
Mechanical Engineering

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10.1016/j.taml.2020.01.005

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title = "An analytical model to predict diffusion induced intermetallic compounds growth in Cu-Sn-Cu sandwich structures",

abstract = "A mass diffusion model is developed to describe the growth kinetics of Cu6Sn5 intermetallic compounds (IMC) in the Cu-Sn-Cu sandwich structure. The proposed model is based on the local interfacial mass conversation law where interfacial Cu/Sn reactions and atomic diffusion are considered. Theoretical analysis shows that the IMC thickness growth is proportional to the square root of the product of the diffusion coefficient and time. The proposed model can explain the polarity effect of electromigration on kinetics of IMC growth where all the parameters have clear physical meaning. The theoretical predictions are compared with experimental results and show reasonable accuracy.",

keywords = "Diffusion, Electromigration, Intermetallic compounds, Polarity effect, Size effect",

author = "Yuexing Wang and Yao Yao and Leon Keer",

note = "Funding Information: The authors would like to acknowledge the financial support by the National Natural Science Foundation of China ( Grants 11572249 and 11772257 ) and the Fundamental Research Funds for the Central Universities ( Grant G2019KY05212 ). Publisher Copyright: {\textcopyright} 2020 The Authors. Published by Elsevier Ltd on behalf of The Chinese Society of Theoretical and Applied Mechanics",

year = "2020",

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doi = "10.1016/j.taml.2020.01.005",

language = "English (US)",

volume = "10",

pages = "33--37",

journal = "Theoretical and Applied Mechanics Letters",

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T1 - An analytical model to predict diffusion induced intermetallic compounds growth in Cu-Sn-Cu sandwich structures

AU - Wang, Yuexing

AU - Yao, Yao

AU - Keer, Leon

N1 - Funding Information: The authors would like to acknowledge the financial support by the National Natural Science Foundation of China ( Grants 11572249 and 11772257 ) and the Fundamental Research Funds for the Central Universities ( Grant G2019KY05212 ). Publisher Copyright: © 2020 The Authors. Published by Elsevier Ltd on behalf of The Chinese Society of Theoretical and Applied Mechanics

PY - 2020/1

Y1 - 2020/1

N2 - A mass diffusion model is developed to describe the growth kinetics of Cu6Sn5 intermetallic compounds (IMC) in the Cu-Sn-Cu sandwich structure. The proposed model is based on the local interfacial mass conversation law where interfacial Cu/Sn reactions and atomic diffusion are considered. Theoretical analysis shows that the IMC thickness growth is proportional to the square root of the product of the diffusion coefficient and time. The proposed model can explain the polarity effect of electromigration on kinetics of IMC growth where all the parameters have clear physical meaning. The theoretical predictions are compared with experimental results and show reasonable accuracy.

AB - A mass diffusion model is developed to describe the growth kinetics of Cu6Sn5 intermetallic compounds (IMC) in the Cu-Sn-Cu sandwich structure. The proposed model is based on the local interfacial mass conversation law where interfacial Cu/Sn reactions and atomic diffusion are considered. Theoretical analysis shows that the IMC thickness growth is proportional to the square root of the product of the diffusion coefficient and time. The proposed model can explain the polarity effect of electromigration on kinetics of IMC growth where all the parameters have clear physical meaning. The theoretical predictions are compared with experimental results and show reasonable accuracy.

KW - Diffusion

KW - Electromigration

KW - Intermetallic compounds

KW - Polarity effect

KW - Size effect

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DO - 10.1016/j.taml.2020.01.005

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SN - 2095-0349

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SP - 33

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JO - Theoretical and Applied Mechanics Letters

JF - Theoretical and Applied Mechanics Letters

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An analytical model to predict diffusion induced intermetallic compounds growth in Cu-Sn-Cu sandwich structures

Abstract

Keywords

ASJC Scopus subject areas

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