Abstract
A mass diffusion model is developed to describe the growth kinetics of Cu6Sn5 intermetallic compounds (IMC) in the Cu-Sn-Cu sandwich structure. The proposed model is based on the local interfacial mass conversation law where interfacial Cu/Sn reactions and atomic diffusion are considered. Theoretical analysis shows that the IMC thickness growth is proportional to the square root of the product of the diffusion coefficient and time. The proposed model can explain the polarity effect of electromigration on kinetics of IMC growth where all the parameters have clear physical meaning. The theoretical predictions are compared with experimental results and show reasonable accuracy.
Original language | English (US) |
---|---|
Pages (from-to) | 33-37 |
Number of pages | 5 |
Journal | Theoretical and Applied Mechanics Letters |
Volume | 10 |
Issue number | 1 |
DOIs | |
State | Published - Jan 2020 |
Keywords
- Diffusion
- Electromigration
- Intermetallic compounds
- Polarity effect
- Size effect
ASJC Scopus subject areas
- Computational Mechanics
- Environmental Engineering
- Civil and Structural Engineering
- Biomedical Engineering
- Aerospace Engineering
- Ocean Engineering
- Mechanics of Materials
- Mechanical Engineering