Atomic gold-enabled three-dimensional lithography for silicon mesostructures

Zhiqiang Luo, Yuanwen Jiang, Benjamin D. Myers, Dieter Isheim, Jinsong Wu, John F. Zimmerman, Zongan Wang, Qianqian Li, Yucai Wang, Xinqi Chen, Vinayak P. Dravid, David N. Seidman, Bozhi Tian*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

67 Scopus citations

Abstract

Three-dimensional (3D) mesostructured semiconductors show promising properties and applications; however, to date, few methods exist to synthesize or fabricate such materials. Metal can diffuse along semiconductor surfaces, and even trace amounts can change the surface behavior. We exploited the phenomena for 3D mesoscale lithography, by showing one example where iterated deposition-diffusion-incorporation of gold over silicon nanowires forms etchant-resistant patterns. This process is facet-selective, producing mesostructured silicon spicules with skeletonlike morphology, 3D tectonic motifs, and reduced symmetries. Atom-probe tomography, coupled with other quantitative measurements, indicates the existence and the role of individual gold atoms in forming 3D lithographic resists. Compared to other more uniform silicon structures, the anisotropic spicule requires greater force for detachment from collagen hydrogels, suggesting enhanced interfacial interactions at the mesoscale.

Original languageEnglish (US)
Pages (from-to)1451-1455
Number of pages5
JournalScience
Volume348
Issue number6242
DOIs
StatePublished - Jun 26 2015

ASJC Scopus subject areas

  • General

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