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Atomistic-to-Continuum Coupling Methods for Heat Transfer in Solids
Gregory J. Wagner
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Corresponding author for this work
Mechanical Engineering
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Chapter in Book/Report/Conference proceeding
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Chapter
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Keyphrases
Coupling Method
100%
Temperature Field
100%
Simulation Techniques
100%
Heat Transfer in Solids
100%
Atomistic-to-continuum Coupling
100%
Atomistic Simulation
50%
Molecular Dynamics
50%
Semiconductors
50%
Atomic Scale
50%
Computational Cost
50%
Modeling Approach
50%
Thermal Model
50%
Scaling Behavior
50%
Thermal Energy
50%
Coupled System
50%
Mechanical Model
50%
Electron Temperature
50%
Stress-strain
50%
Heat Flux
50%
Coupled Simulation
50%
Atomic Vibrations
50%
Atomistic-to-continuum
50%
Stress Temperature
50%
Thermal Boundary Conditions
50%
Surface Grain
50%
Thermal Data
50%
Continuum Simulation
50%
Continuum Concept
50%
Grain Boundary Defects
50%
Heat Capture
50%
Engineering
Temperature Distribution
100%
Simulation Mode
100%
Applicability
50%
Thermal Model
50%
Length Scale
50%
Mechanical Model
50%
Thermal Boundary Condition
50%
Coupled System
50%
Surface Grain
50%
Computational Cost
50%
Thermal Energy
50%
Grain Boundaries
50%
Electron Energy
50%
Heat Flux
50%
Material Science
Surface (Surface Science)
100%
Grain Boundaries
100%
Chemical Engineering
Temperature Distribution
100%
Heat Flux
50%