Automated micro-transfer printing with cantilevered stamps

Numair Ahmed*, Andrew Carlson, John A. Rogers, Placid M. Ferreira

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution


This paper demonstrates the use of a flexible instrumented stamp to enable automated micro transfer printing as a route to large-area, deterministic assembly of microstructured device components or 'inks'. The ability to instrument the stamp, a critical component for retrieval and placement of a micro device, to detect contact and monitor localized forces during critical events in the printing process not only allows for the development of a robust manufacturing process, but also for a unique vantage point from which to study fundamental issues and phenomena associated with adhesion and delamination of thin films from a variety of substrate materials. This paper presents basic design analysis on the requirements of the cantilevers for compatibility with a typical transfer printing environment. Off-the-shelf thin film strain gages are integrated with a thin elastomeric post as a preliminary prototype and the feasibility of transfer printing with it is demonstrated. Further, the set-up is calibrated to produce force signals for event detection and in-situ diagnosis of the process.

Original languageEnglish (US)
Title of host publication39th North American Manufacturing Research Conference 2011 - Transactions of the North American Manufacturing Research Institution of SME
Number of pages10
StatePublished - Nov 9 2011
Event39th Annual North American Manufacturing Research Conference, NAMRC39 - Corvallis, OR, United States
Duration: Jun 13 2011Jun 17 2011

Publication series

NameTransactions of the North American Manufacturing Research Institution of SME
ISSN (Print)1047-3025


Other39th Annual North American Manufacturing Research Conference, NAMRC39
Country/TerritoryUnited States
CityCorvallis, OR


  • Cantilevered stamps
  • Flexible electronics manufacturing
  • Micro transfer printing
  • Transfer printing

ASJC Scopus subject areas

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering


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